Справочник Пользователя для Intel Xeon X3440 BX80605X3440
Модели
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
21
LGA1156 Socket
3.1
Board Layout
The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction (see
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction (see
). This was to achieve a common package
land to PCB land offset that ensures a single PCB layout for socket designs from the
multiple vendors.
multiple vendors.
Figure 3-3. LGA1156 Socket Land Pattern (Top View of Board)
A
C
E
G
J
L
N
R
U
W AA AC AE AG AJ AL AN AR AU AW
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
A
C
E
G
J
L
N
R
U
W AA AC AE AG AJ AL AN AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)
A
C
E
G
J
L
N
R
U
W AA AC AE AG AJ AL AN AR AU AW
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
A
C
E
G
J
L
N
R
U
W AA AC AE AG AJ AL AN AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)