Справочник Пользователя для Intel 4 551 BX80547PG3400EK

Модели

BX80547PG3400EK

Datasheet

Package Mechanical Specifications

3.5

Package Insertion Specifications

The Pentium 4 processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.

3.6

Processor Mass Specification

The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.

3.7

Processor Materials

Table 3-3

lists some of the package components and associated materials.

3.8

Processor Markings

Figure 3-5

and

Figure 3-6

show the topside markings on the processor. These diagrams aid in the

identification of the Pentium 4 processor in the 775-land package.

Table 3-3. Processor Materials

Component

Material

Integrated Heat Spreader (IHS)

Nickel Plated Copper

Substrate

Fiber Reinforced Resin

Substrate Lands

Gold Plated Copper

Figure 3-5. Processor Top-Side Marking Example

ATPO
S/N

S-Spec/Country of Assy

INTEL
Pentium 4

SLxxx [COO]

[FPO]

‘04

Frequency/L2 Cache/Bus/

775_VR_CONFIG_04x

FPO

2-D Matrix Mark

Unique Unit
Identifier
ATPO Serial #

3.60GHz/1M/800/04B