Справочник ПользователяСодержаниеContents3List of Figures5List of Tables7Revision History9Chapter 1 Introduction111.1 Summary of Requirements11Chapter 2 Processor Thermal Solutions132.1 Processor Specifications13Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors132.2 Socket Description14Figure 1. The 1207-Pin Socket14Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution153.1 Motherboard Component Height Restrictions15Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution153.2 Thermal Solution Design Requirements16Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors163.3 Sample Heat Sinks and Attachment Methods16Table 3. Components for the Processor Thermal Reference Design for the AMD PIB Thermal Solution17Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors183.3.1 Backplate Assembly183.3.2 Retention Frame19Chapter 4 Thermal Design of Custom 1U-2P Systems214.1 Motherboard Component Height Restrictions21Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems214.2 Thermal Solution Design Requirements22Table 4. Thermal Solution Design Requirements for Custom 1U-2P Systems224.3 Sample Heat Sinks and Attachment Methods22Table 5. Components for the Processor Thermal Reference Design for Custom 1U-2P Systems23Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems244.3.1 Backplate Assembly244.3.2 Spring Screws244.3.3 Heat Sink25Figure 6. High Performance Heat Sink for Custom 1U-2P Systems25Table 6. Fin Parameters25Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor in 90 nm Process264.3.4 Fans264.3.5 Thermal Interface Material27Chapter 5 Thermal Design of Custom 2U-4P Systems295.1 Motherboard Component Height Restrictions29Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems295.2 Thermal Solution Design Requirements30Table 7. Thermal Solution Design Requirements for Custom 2U-4P Systems305.3 Sample Heat Sinks and Attachment Methods30Table 8. Components for the Processor Thermal Reference Design for Custom 2U-4P Systems31Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors325.3.1 Backplate Assembly325.3.2 Spring Clip33Table 9. Chemical Element of SK7 Spring Steel335.3.3 Retention Frame335.3.4 Heat Sink33Figure 10. High Performance Heat Sink for Custom 2U-4P Systems34Table 10. Fin Parameters34Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor in 90 nm Process355.3.5 Fans355.3.6 Thermal Interface Material35Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors37Figure 12. Socket F (1207) PIB Board Component Height Restrictions38Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone39Figure 14. Socket F (1207) PIB Socket Outline and Socket Window40Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone41Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out42Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out43Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Processor45Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions46Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone47Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window48Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone49Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out50Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone51Appendix C Keep-Out Drawings for Custom 2U- 4P Systems Based on the Socket F (1207) Processor53Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions54Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone55Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window56Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone57Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out58Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone59Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors61Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System61Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System62Размер: 1,7 МБСтраницы: 62Язык: EnglishПросмотреть