Справочник Пользователя (LE80537GG0412M)СодержаниеIntel® Core™2 Duo Processors and Intel® Core™2 Extreme Processors for Platforms Based on Mobile Intel® 965 Express Chipset Family1Contents3Revision History51 Introduction71.1 Terminology81.2 References92 Low Power Features112.1 Clock Control and Low Power States112.1.1 Core Low Power State Descriptions132.1.2 Package Low Power State Descriptions152.2 Enhanced Intel SpeedStep® Technology182.2.1 Dynamic FSB Frequency Switching192.2.2 Intel® Dynamic Acceleration Technology192.3 Extended Low Power States192.4 FSB Low Power Enhancements202.5 VID-x202.6 Processor Power Status Indicator (PSI-2) Signal213 Electrical Specifications233.1 Power and Ground Pins233.2 FSB Clock (BCLK[1:0]) and Processor Clocking233.3 Voltage Identification233.4 Catastrophic Thermal Protection263.5 Reserved and Unused Pins263.6 FSB Frequency Select Signals (BSEL[2:0])273.7 FSB Signal Groups273.8 CMOS Signals293.9 Maximum Ratings293.10 Processor DC Specifications304 Package Mechanical Specifications and Pin Information414.1 Package Mechanical Specifications414.2 Processor Pinout and Pin List494.3 Alphabetical Signals Reference695 Thermal Specifications and Design Considerations775.1 Thermal Specifications805.1.1 Thermal Diode815.1.2 Thermal Diode Offset835.1.3 Intel® Thermal Monitor845.1.4 Digital Thermal Sensor865.1.5 Out of Specification Detection875.1.6 PROCHOT# Signal Pin87Размер: 1,5 МБСтраницы: 87Язык: EnglishПросмотреть
