Инструкции для Intel 4 1.30 GHz

Содержание

• 1.0 Introduction

  7
  • 1.1 Terminology

    8
    • 1.1.1 Processor Packaging Terminology

      8
  • 1.2 References

    9
    • Table 1. References

      9
• 2.0 Electrical Specifications

  11
  • 2.1 System Bus and GTLREF

    11
  • 2.2 Power and Ground Pins

    11
  • 2.3 Decoupling Guidelines

    11
    • 2.3.1 VCC Decoupling

      12
    • 2.3.2 System Bus AGTL+ Decoupling

      12
    • 2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking

      12
  • 2.4 Voltage Identification

    12
    • Table 2. Voltage Identification Definition

      13
    • 2.4.1 Phase Lock Loop (PLL) Power and Filter

      13
      • Figure 1. Typical VCCIOPLL, VCCA and VSSA Power Distribution

        14
      • Figure 2. Phase Lock Loop (PLL) Filter Requirements

        15
  • 2.5 Reserved, Unused Pins, and TESTHI[10:0]

    15
  • 2.6 System Bus Signal Groups

    16
    • Table 3. System Bus Pin Groups (Page 1 of 2)

      16
  • 2.7 Asynchronous GTL+ Signals

    17
  • 2.8 Test Access Port (TAP) Connection

    17
  • 2.9 Maximum Ratings

    18
    • Table 4. Processor DC Absolute Maximum Ratings

      18
  • 2.10 Processor DC Specifications

    18
    • Table 5. Voltage and Current Specifications

      19
    • Table 6. System Bus Differential BCLK Specifications

      20
    • Table 7. AGTL+ Signal Group DC Specifications

      20
    • Table 8. Asynchronous GTL+ and TAP Signal Group DC Specifications

      21
  • 2.11 AGTL+ System Bus Specifications

    21
    • Table 9. AGTL+ Bus Voltage Definitions

      21
  • 2.12 System Bus AC Specifications

    22
    • Table 10. System Bus Differential Clock Specifications

      22
    • Table 11. System Bus Common Clock AC Specifications

      23
    • Table 12. System Bus Source Synch AC Specifications AGTL+ Signal Group

      23
    • Table 13. Asynchronous GTL+ Signals AC Specifications

      24
    • Table 14. System Bus AC Specifications (Reset Conditions)

      24
    • Table 15. TAP Signals AC Specifications

      25
  • 2.13 Processor AC Timing Waveforms

    25
    • Figure 3. AC Test Circuit

      26
    • Figure 4. TCK Clock Waveform

      26
    • Figure 5. Differential Clock Waveform

      27
    • Figure 6. System Bus Common Clock Valid Delay Timings

      27
    • Figure 7. System Bus Reset and Configuration Timings

      28
    • Figure 8. Source Synchronous 2X (Address) Timings

      28
    • Figure 9. Source Synchronous 4X Timings

      29
    • Figure 10. Power-On Reset and Configuration Timings

      29
    • Figure 11. Test Reset Timings

      30
• 3.0 System Bus Signal Quality Specifications

  31
  • 3.1 BCLK Signal Quality Specifications and Measurement Guidelines

    31
    • Table 16. BCLK Signal Quality Specifications

      31
    • Figure 12. BCLK[1:0] Signal Integrity Waveform

      32
  • 3.2 System Bus Signal Quality Specifications and Measurement Guidelines

    32
    • Table 17. Ringback Specifications for AGTL+, Asynchronous GTL+, and TAP Signal Groups

      32
    • Figure 13. Low-to-High System Bus Receiver Ringback Tolerance

      33
    • Figure 14. High-to-Low System Bus Receiver Ringback Tolerance

      33
  • 3.3 System Bus Signal Quality Specifications and Measurement Guidelines

    33
    • 3.3.1 Overshoot/Undershoot Guidelines

      33
    • 3.3.2 Overshoot/Undershoot Magnitude

      34
    • 3.3.3 Overshoot/Undershoot Pulse Duration

      34
    • 3.3.4 Activity Factor

      34
    • 3.3.5 Reading Overshoot/Undershoot Specification Tables

      35
    • 3.3.6 Determining if a System Meets the Over/Undershoot Specifications

      35
      • Table 18. Source Synchronous (400MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.7V Pro...

        37
      • Table 19. Source Synchronous (200MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.7V Pro...

        37
      • Table 20. Common Clock (100MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.7V Processors)

        38
      • Table 21. Asynchronous GTL+ and TAP Signal Groups Overshoot/Undershoot Tolerance (1.7V Processors)

        38
      • Table 22. Source Synchronous (400MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.75V Pr...

        39
      • Table 23. Source Synchronous (200MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.75V Pr...

        39
      • Table 24. Common Clock (100MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance (1.75V Processors)

        40
      • Table 25. Asynchronous GTL+ and TAP Signal Groups Overshoot/Undershoot Tolerance (1.75V Processors)

        40
      • Figure 15. Maximum Acceptable Overshoot/Undershoot Waveform

        41
• 4.0 Package Mechanical Specifications

  43
  • Figure 16. Exploded View of Processor Components on a System Board

    43
  • Figure 17. Processor Package

    44
  • Table 26. Description Table for Processor Dimensions

    45
  • Figure 18. Processor Cross-Section and Keep-in

    45
  • Figure 19. Processor Pin Detail

    46
  • Figure 20. IHS Flatness Specification

    46
  • 4.1 Package Load Specifications

    46
    • Table 27. Package Dynamic and Static Load Specifications

      47
  • 4.2 Processor Insertion Specifications

    47
  • 4.3 Processor Mass Specifications

    47
    • Table 28. Processor Mass

      47
  • 4.4 Processor Materials

    47
    • Table 29. Processor Material Properties

      48
  • 4.5 Processor Markings

    48
    • Figure 21. Processor Markings

      48
  • 4.6 Processor Pin-Out Coordinates

    48
    • Figure 22. Processor Pinout Diagram - Bottom View

      49
    • Table 30. Pin Listing by Pin Name

      51
    • Table 31. Pin Listing by Pin Number

      57
• 5.0 Pin Listing and Signal Definitions

  51
  • 5.1 Processor Pin Assignments

    51
    • 5.1.1 Pin Listing by Pin Name

      51
    • 5.1.2 Pin Listing by Pin Number

      57
  • 5.2 Alphabetical Signals Reference

    63
    • Table 32. Signal Description (Page 1 of 8)

      63
• 6.0 Thermal Specifications and Design Considerations

  71
  • Figure 23. Example Thermal Solution (Not to scale)

    71
  • 6.1 Thermal Specifications

    72
    • Table 33. Processor Thermal Design Power

      72
  • 6.2 Thermal Analysis

    73
    • 6.2.1 Measurements For Thermal Specifications

      73
      • 6.2.1.1 Processor Case Temperature Measurement

        73
        • Figure 24. Guideline Locations for Case Temperature (TCASE) Thermocouple Placement

          73
        • Figure 25. Technique for Measuring with 0 Degree Angle Attachment

          73
        • Figure 26. Technique for Measuring with 90 Degree Angle Attachment

          74
• 7.0 Features

  75
  • 7.1 Power-On Configuration Options

    75
    • Table 34. Power-On Configuration Option Pins

      75
  • 7.2 Clock Control and Low Power States

    75
    • 7.2.1 Normal State—State 1

      75
    • 7.2.2 AutoHALT Powerdown State—State 2

      75
      • Figure 27. Stop Clock State Machine

        76
    • 7.2.3 Stop-Grant State—State 3

      76
    • 7.2.4 HALT/Grant Snoop State—State 4

      77
    • 7.2.5 Sleep State—State 5

      77
    • 7.2.6 Deep Sleep State—State 6

      78
  • 7.3 Thermal Monitor

    78
    • 7.3.1 Thermal Diode

      79
      • Table 35. Thermal Diode Parameters

        79
      • Table 36. Thermal Diode Interface

        80
• 8.0 Boxed Processor Specifications

  81
  • 8.1 Introduction

    81
    • Figure 28. Mechanical Representation of the Boxed Pentium 4 Processor

      81
  • 8.2 Mechanical Specifications

    81
    • 8.2.1 Boxed Processor Fan Heatsink Dimensions

      82
      • Figure 29. Side View Space Requirements for the Boxed Processor

        82
      • Figure 30. Top View Space Requirements for the Boxed Processor

        83
    • 8.2.2 Boxed Processor Fan Heatsink Weight

      83
    • 8.2.3 Boxed Processor Retention Mechanism and Fan Heatsink Supports

      83
  • 8.3 Boxed Processor Requirements

    84
    • 8.3.1 Fan Heatsink Power Supply

      84
      • Figure 31. Boxed Processor Fan Heatsink Power Cable Connector Description

        84
      • Table 37. Fan Heatsink Power and Signal Specifications

        84
      • Figure 32. Acceptable System Board Power Header Placement Relative to Processor Socket

        85
  • 8.4 Thermal Specifications

    85
    • 8.4.1 Boxed Processor Cooling Requirements

      85
      • Figure 33. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)

        86
      • Figure 34. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)

        86
    • 8.4.2 Variable Speed Fan

      87
      • Figure 35. Boxed Processor Fan Heatsink Set Points

        87
      • Table 38. Boxed Processor Fan Heatsink Set Points

        87
• 9.0 Debug Tools Specifications

  89
  • 9.1 Logic Analyzer Interface (LAI)

    89
    • 9.1.1 Mechanical Considerations

      89
    • 9.1.2 Electrical Considerations

      89