Инструкции для Intel C2D T5870

Содержание

• Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process

  1
• Revision History

  6
• 1 Introduction

  7
  • 1.1 Terminology

    8
  • 1.2 References

    9
• 2 Low Power Features

  11
  • 2.1 Clock Control and Low-Power States

    11
    • 2.1.1 Core Low-Power State Descriptions

      13
    • 2.1.2 Package Low-power State Descriptions

      15
  • 2.2 Enhanced Intel SpeedStep® Technology

    19
  • 2.3 Extended Low-Power States

    20
  • 2.4 FSB Low Power Enhancements

    21
    • 2.4.1 Dynamic FSB Frequency Switching

      21
    • 2.4.2 Enhanced Intel® Dynamic Acceleration Technology

      22
  • 2.5 VID-x

    23
  • 2.6 Processor Power Status Indicator (PSI-2) Signal

    23
• 3 Electrical Specifications

  25
  • 3.1 Power and Ground Pins

    25
  • 3.2 Decoupling Guidelines

    25
    • 3.2.1 VCC Decoupling

      25
    • 3.2.2 FSB AGTL+ Decoupling

      25
    • 3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking

      25
  • 3.3 Voltage Identification and Power Sequencing

    26
  • 3.4 Catastrophic Thermal Protection

    29
  • 3.5 Reserved and Unused Pins

    29
  • 3.6 FSB Frequency Select Signals (BSEL[2:0])

    29
  • 3.7 FSB Signal Groups

    30
  • 3.8 CMOS Signals

    31
  • 3.9 Maximum Ratings

    31
  • 3.10 Processor DC Specifications

    32
• 4 Package Mechanical Specifications and Pin Information

  51
  • 4.1 Package Mechanical Specifications

    51
  • 4.2 Processor Pinout and Pin List

    59
  • 4.3 Alphabetical Signals Reference

    93
• 5 Thermal Specifications and Design Considerations

  101
  • 5.1 Monitoring Die Temperature

    108
    • 5.1.1 Thermal Diode

      108
    • 5.1.2 Intel® Thermal Monitor

      109
    • 5.1.3 Digital Thermal Sensor

      111
  • 5.2 Out of Specification Detection

    112
  • 5.3 PROCHOT# Signal Pin

    112