Техническая Спецификация (BX80563L5320A)Содержание1 Introduction91.1 Terminology111.2 State of Data131.3 References132 Electrical Specifications152.1 Front Side Bus and GTLREF152.2 Power and Ground Lands162.3 Decoupling Guidelines162.3.1 VCC Decoupling162.3.2 VTT Decoupling162.3.3 Front Side Bus AGTL+ Decoupling172.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking172.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])182.4.2 PLL Power Supply192.5 Voltage Identification (VID)192.6 Reserved, Unused, or Test Signals212.7 Front Side Bus Signal Groups222.8 CMOS Asynchronous and Open Drain Asynchronous Signals242.9 Test Access Port (TAP) Connection242.10 Platform Environmental Control Interface (PECI) DC Specifications242.10.1 DC Characteristics242.10.2 Input Device Hysteresis252.11 Mixing Processors252.12 Absolute Maximum and Minimum Ratings262.13 Processor DC Specifications272.13.1 Flexible Motherboard Guidelines (FMB)272.13.2 VCC Overshoot Specification402.13.3 Die Voltage Validation412.14 AGTL+ FSB Specifications413 Mechanical Specifications453.1 Package Mechanical Drawings453.2 Processor Component Keepout Zones493.3 Package Loading Specifications493.4 Package Handling Guidelines503.5 Package Insertion Specifications503.6 Processor Mass Specifications503.7 Processor Materials503.8 Processor Markings513.9 Processor Land Coordinates514 Land Listing554.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments554.1.1 Land Listing by Land Name554.1.2 Land Listing by Land Number675 Signal Definitions775.1 Signal Definitions776 Thermal Specifications856.1 Package Thermal Specifications856.1.1 Thermal Specifications856.2936.2.1 Thermal Metrology956.3 Processor Thermal Features966.3.1 Thermal Monitor Features966.3.2 Thermal Monitor (TM1)966.3.3 Thermal Monitor 2976.3.4 On-Demand Mode986.3.5 PROCHOT# Signal996.3.6 FORCEPR# Signal996.3.7 THERMTRIP# Signal1006.4 Platform Environment Control Interface (PECI)1006.4.1 Introduction1006.4.2 PECI Specifications1017 Features1037.1 Power-On Configuration Options1037.2 Clock Control and Low Power States1037.2.1 Normal State1047.2.2 HALT or Extended HALT State1047.2.3 Stop-Grant State1067.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State1077.3 Enhanced Intel SpeedStep® Technology1078 Boxed Processor Specifications1098.1 Introduction1098.2 Mechanical Specifications1118.2.1 Boxed Processor Heat Sink Dimensions (CEK)1118.2.2 Boxed Processor Heat Sink Weight1198.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)1198.3 Electrical Requirements1198.3.1 Fan Power Supply (Active CEK)1198.3.2 Boxed Processor Cooling Requirements1208.4 Boxed Processor Contents1219 Debug Tools Specifications1239.1 Debug Port System Requirements1239.2 Target System Implementation1239.2.1 System Implementation1239.3 Logic Analyzer Interface (LAI)1239.3.1 Mechanical Considerations1249.3.2 Electrical Considerations124Размер: 4,3 МБСтраницы: 124Язык: EnglishПросмотреть