Техническая Спецификация (LF80537NF0341MN)Содержание1 Introduction71.1 Terminology81.2 References92 Low Power Features112.1 Clock Control and Low Power States112.1.1 Core Low-Power States122.1.2 Package Low-Power States132.2 Enhanced Intel SpeedStep® Technology152.3 Low-Power FSB Features162.4 Processor Power Status Indicator (PSI#) Signal173 Electrical Specifications193.1 Power and Ground Pins193.2 FSB Clock (BCLK[1:0]) and Processor Clocking193.3 Voltage Identification193.4 Catastrophic Thermal Protection223.5 Reserved and Unused Pins223.6 FSB Frequency Select Signals (BSEL[2:0])233.7 FSB Signal Groups233.8 CMOS Signals253.9 Maximum Ratings253.10 Processor DC Specifications264 Package Mechanical Specifications and Pin Information334.1 Package Mechanical Specifications334.2 Processor Pinout and Pin List394.3 Alphabetical Signals Reference755 Thermal Specifications and Design Considerations835.1 Monitoring Die Temperature845.1.1 Thermal Diode855.1.2 Thermal Diode Offset875.1.3 Intel® Thermal Monitor885.1.4 Digital Thermal Sensor895.1.5 Out of Specification Detection905.1.6 PROCHOT# Signal Pin90Размер: 1,6 МБСтраницы: 98Язык: EnglishПросмотреть