印刷电路板刻蚀配件
- 72110 Developer
- 72122 Developer
- 73131-01
- 80106 Rivets For Through-contacting
- 80108 Rivets For Through-contacting
用户手册 — Bungard
65
个产品
126
份说明书
印刷电路板布局设计
- 172015.140 New Silver For Etched Part Production (L x W x H) 140 x 200 x 0.15 mm Silver
- 172015.280 New Silver For Etched Part Production (L x W x H) 280 x 200 x 0.15 mm Silver
- 172020.140 New Silver For Etched Part Production (L x W x H) 140 x 200 x 0.20 mm Silver
- 172020.280 New Silver For Etched Part Production (L x W x H) 280 x 200 x 0.20 mm Silver
- 5020 Instructions
环氧树脂电路板
- 100mm x 100mm x 1.5mm, Photo Resist PCB, 1 pc(s)x, 020306E75
- 100mm x 50mm x 1.5mm, Photo Resist PCB, 1 pc(s)x, 020306E70
- 100mm x 60mm x 1.5mm, Photo Resist PCB, 1 pc(s)x, 050306E50
- 100mm x 60mm x 1.5mm, Photo Resist PCB, 1 pc(s)x, 150306E50/100X60MM
- 100mm x 75mm x 1.5mm, Photo Resist PCB, 1 pc(s)x, 020306E30
结合纸张电路板
- 030306E30 Circuit Board Base Material Cu-coating (L x W x H) 100 x 75 x 1.5 mm Hard paper/single-sided/1 x 35 µm
- 030306E33 Circuit Board Base Material Cu-coating (L x W x H) 160 x 100 x 1.5 mm Hard paper/single-sided/1 x 35 µ
- 030306E35 Circuit Board Base Material Cu-coating (L x W x H) 300 x 200 x 1.5 mm Hard paper/single-sided/1 x 35 µ
- 030306E38 Circuit Board Base Material Cu-coating (L x W x H) 200 x 150 x 1.5 mm Hard paper/single-sided/1 x 35 µ
- 030306E50 Circuit Board Base Material Cu-coating (L x W x H) 100 x 60 x 1.5 mm Hard paper/single-sided/1 x 35 µm