Intel SL2YM 用户手册
Datasheet
5
Pentium
®
II
Processor at 350 MHz, 400 MHz, and 450 MHz
24
Pentium
®
II Processor (S.E.C.C. Package)—Extended Thermal Plate
Attachment Detail Dimensions, Continued.......................................................... 50
25
Pentium
®
II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions ............................................................................................50
26
Pentium
®
II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions, Detail A..............................................................................51
27
Pentium
®
II Processor Markings (S.E.C.C. Package) ......................................... 51
28
Pentium
®
II Processor (S.E.C.C.2 Package) Top and Side Views—
OLGA Processor Core ........................................................................................ 52
29
Pentium
®
II Processor (S.E.C.C.2 Package) Top and Side Views—
PLGA Processor Core......................................................................................... 53
30
Pentium
®
II Processor Assembly (S.E.C.C.2 Package)—Primary View ............. 53
31
Pentium
®
II Processor Assembly (S.E.C.C.2 Package)—Cover View with
Dimensions.......................................................................................................... 54
32
Pentium
®
II Processor Assembly (S.E.C.C.2 Package)—Heat Sink Attach
Boss Section ....................................................................................................... 54
33
Pentium
®
II Processor Assembly (S.E.C.C.2 Package), Side View—
OLGA Substrate Shown ...................................................................................... 55
34
Detail View of Cover in the Vicinity of the Substrate Attach Features ................. 55
35
Pentium
®
II Processor Substrate (S.E.C.C.2 Package), Edge Finger Contact
Dimensions.......................................................................................................... 56
36
Pentium
®
II Processor Markings (S.E.C.C.2 Package) ....................................... 56
37
Boxed Pentium
®
II Processor in the S.E.C.C. Packaging Installed in Retention
Mechanism (Fan Power Cable Not Shown) ....................................................... 65
38
Boxed Pentium
®
II Processor in the S.E.C.C.2 Packaging (Fan Power Cable
Not Shown)......................................................................................................... 65
39
Side View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................ 66
Packaging............................................................................................................ 66
40
Front View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................ 67
Packaging............................................................................................................ 67
41
Side View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................ 67
Packaging............................................................................................................ 67
42
Front View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................ 68
Packaging............................................................................................................ 68
43
Top View Air Space Requirements for the Boxed Processor.............................. 68
44
Heatsink Support Hole Locations and Size ......................................................... 70
45
Side View Space Requirements for Boxed Processor Fan Heatsink Supports... 71
46
Top View Space Requirements for Boxed Processor Fan Heatsink Supports ... 71
47
Boxed Processor Fan Heatsink Power Cable Connector Description................. 72
48
Recommended Motherboard Power Header Placement Relative to Fan Power
Connector and Pentium
Connector and Pentium
®
II Processor ................................................................ 73
Tables
1
Voltage Identification Definition ........................................................................... 16
2
Recommended Pull-up Resistor Values (Approximate) for CMOS Signals ........ 18
3
System Bus Signal Groups ................................................................................. 19
4
Absolute Maximum Ratings................................................................................. 21
5
Voltage and Current Specifications .................................................................... 22
6
AGTL+ Signal Groups DC Specifications ...........................................................24