Intel SL2YM 用户手册
Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet
9
•
Extended Thermal Plate—This S.E.C.C. 100 MHz processor feature is the surface used to
attach a heatsink or other thermal solution to the processor. The extended thermal plate has an
extended skirt as compared to the 66 MHz Pentium II processors for increased thermal
capabilities.
attach a heatsink or other thermal solution to the processor. The extended thermal plate has an
extended skirt as compared to the 66 MHz Pentium II processors for increased thermal
capabilities.
•
Cover—The plastic casing that covers the backsire of the substrate and holds processor
branding and marking information.
branding and marking information.
•
Latch arms—An S.E.C.C. processor feature which can be used as a means for securing the
processor in the retention mechanism(s).
processor in the retention mechanism(s).
•
PLGA - Plastic Land Grid Array. This package technology incorporates a heat slug within the
package that contacts the extended thermal plate.
package that contacts the extended thermal plate.
•
OLGA - Organic Land Grid Array. This package technology permits attaching the heatsink
directly to the die.
directly to the die.
Additional terms referred to in this and other related documentation:
•
SC 242—The 242-contact slot connector (previously referred to as Slot 1 connector) that the
S.E.C.C. and S.E.C.C.2 plug into, just as the Pentium
S.E.C.C. and S.E.C.C.2 plug into, just as the Pentium
®
Pro processor uses Socket 8.
•
Retention mechanism—An enabled mechanical piece which holds the S.E.C. cartridge in the
SC 242 connector.
SC 242 connector.
•
Heatsink support—The support pieces that are mounted on the motherboard to provide added
support for heatsinks.
support for heatsinks.
The L2 cache (TagRAM, BSRAM) die keep industry names.
1.2
References
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
following documents:
•
AP-485, Intel Processor Identification and the CPUID Instruction (Order Number 241618)
•
AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium
®
II Processor and Intel
®
440BX
AGPset (Order Number 243735)
•
AP-586, Pentium
®
II Processor Thermal Design Guidelines (Order Number 243331)
•
AP-587, Pentium
®
II Processor Power Distribution Guidelines (Order Number 243332)
•
AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order
Number 243333)
Number 243333)
•
AP-589, Pentium
®
II Processor Electro-Magnetic Interference (Order Number 243334)
•
Pentium
®
II Processor at 233, 266, 300, 333 MHz (Order Number 243335)
•
Pentium
®
II Processor Specification Update (Order Number 243337)
•
Slot 1 Connector Specification (Order Number 243397)
•
Slot 1 Bus Terminator Card Design Guidelines (Order Number 243409)
•
Intel Architecture Software Developer's Manual (Order Number 243193)
— Volume I: Basic Architecture (Order Number 243190)
— Volume II: Instruction Set Reference (Order Number 243191)