Intel 315889-002 用户手册

315889-002

8.10 Safety - PROPOSED ...........................................................................................46

Manufacturing Considerations..................................................................................47
9.1

Lead Free (Pb Free) ...........................................................................................47

Z(f) Constant Output Impedance Design ..................................................................49
A.1

Introduction - PROPOSED ...................................................................................49

A.2

Voltage Transient Tool (VTT) Z(f) Theory ..............................................................52

A.3

VTT Z(f) Measurement Method ............................................................................53

A.4

Results.............................................................................................................53

A.5

Output Decoupling Design Procedure ....................................................................56

Figures

2-1

VRM/EVRD 11.0 Load Current vs. Time .................................................................12

2-2

Processor Vcc Overshoot Example Waveform.........................................................16

2-3

Power Distribution Impedance vs. Frequency.........................................................17

2-4

Power-On Sequence Timing Diagram ....................................................................19

2-5

Processor Transition States .................................................................................21

2-6

Dynamic VID Transition States Illustration ............................................................21

2-7

Six-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 1206 Size Caps.....................................23

2-8

Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 1206 Size Caps.....................................23

2-9

Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 0805 Size Caps.....................................23

2-10 Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP

Power Delivery Impedance Model Path - Example...................................................25

3-1

Remote Sense Routing example...........................................................................30

6-1

VRM 11.0 and Platform Present Detection .............................................................39

7-1

VRM 11.0 Pin Assignments ..................................................................................43

7-1

VRM 11.0 Module and Connector..........................................................................44

A-1

Typical Intel® Microprocessor Voltage Regulator Validation Setup ............................49

A-2

Z(f) Network Plot with 1.25 mW Load Line ............................................................50

A-3

Time Domain Response of a Microprocessor Voltage Regulator.................................51

A-4

Time Domain Responses and Corresponding Fourier Spectra
of Voltage, Current and Impedance ......................................................................53

A-5

Photo of Motherboard Analyzed Showing High Frequency
MLCC Capacitors In the Socket Cavity and Bulk Capacitors ......................................54

A-6

Measured Platform Impedance Profile Showing Change
in Impedance as Capacitors Are Removed .............................................................55

A-7

Designations of MLCC Cavity Capacitor Banks ........................................................55

A-8

Simulated and Measured Waveforms of Platform Impedance Profile ..........................56

Tables

1-1

VRM/EVRD 11.0 Supported Platforms and Processors............................................... 9

1-2

Guideline Categories ..........................................................................................10

2-1

Processor VID signal implementation ....................................................................11

2-2

Icc Guidelines ...................................................................................................13

2-3

VID_Select, LL1, LL0 Codes.................................................................................14

2-4

Impedance Z

Measurement Parameter Limits ......................................................18

2-5

Startup Sequence Timing Parameters ...................................................................19