Intel Desktop Board DP55WG, 10-Pack BLKDP55WG-10PACK 用户手册

产品代码
BLKDP55WG-10PACK
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页码 88
Product Description 
 15
 
1.5 
System Memory 
The board has four DIMM sockets and supports the following memory features: 
•  1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification) 
•  Two independent memory channels with interleaved mode support 
•  Unbuffered, single-sided or double-sided DIMMs with the following restriction: 
Double-sided DIMMs with x16 organization are not supported. 
•  16 GB maximum total system memory (with 2 Gb memory technology).  Refer to 
Section 2.1.1 on page 37 for information on the total amount of addressable 
memory. 
•  Minimum total system memory:  1 GB using 512 MB x16 module 
•  Non-ECC DIMMs 
•  Serial Presence Detect 
•  DDR3 1600 MHz, 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs 
•  XMP version 1.2 performance profile support for memory speeds above 1333 MHz 
 
NOTE 
To be fully compliant with all applicable DDR SDRAM memory specifications, the board 
should be populated with DIMMs that support the Serial Presence Detect (SPD) data 
structure.  This allows the BIOS to read the SPD data and program the chipset to 
accurately configure memory settings for optimum performance.  If non-SPD memory 
is installed, the BIOS will attempt to correctly configure the memory settings, but 
performance and reliability may be impacted or the DIMMs may not function under the 
determined frequency. 
 
Table 3 lists the supported DIMM configurations. 
Table 3.  Supported Memory Configurations 
DIMM 
Capacity 
Configuration
 
(Note)
 
SDRAM 
Density 
SDRAM Organization 
Front-side/Back-side 
Number of SDRAM 
Devices 
1024 MB 
SS 
1 Gbit 
128 M x 8/empty 
2048 MB 
DS 
1 Gbit 
128 M x 8/128 M x 8 
16 
2048 MB 
SS 
2 Gbit 
256 M x 8/empty 
4096 MB 
DS 
2 Gbit 
256 M x8/256 M x 8 
16 
Note:  “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to 
single-sided memory modules (containing one row of SDRAM). 
 
 
For information about…  
Refer to: 
Tested Memory  
XMP Tested Memory