Philips UDA1325 用户手册

1999 May 10

50

Philips Semiconductors

Preliminary specification

Universal Serial Bus (USB) CODEC

UDA1325

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

°

 angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

(1)

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

−

suitable

Surface mount

BGA, SQFP

not suitable

suitable

−

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(3)

suitable

−

PLCC

(4)

, SO, SOJ

suitable

suitable

−

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

−

SSOP, TSSOP, VSO

not recommended

(6)

suitable

−