Cypress CY7C1518AV18 用户手册

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页码 30
72-Mbit DDR-II SRAM 2-Word
Burst Architecture
CY7C1516AV18, CY7C1527AV18
CY7C1518AV18, CY7C1520AV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Document Number: 001-06982 Rev. *D
 Revised June 16, 2008
Features
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
300 MHz clock for high bandwidth
2-word burst for reducing address bus frequency 
Double Data Rate (DDR) interfaces 
(data transferred at 600 MHz) at 300 MHz 
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock 
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed 
systems
Synchronous internally self-timed writes
DDR-II operates with 1.5 cycle read latency when Delay Lock 
Loop (DLL) is enabled
Operates as a DDR-I device with 1 cycle read latency in DLL 
off mode
1.8V core power supply with HSTL inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4V–V
DD
)
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1516AV18 – 8M x 8
CY7C1527AV18 – 8M x 9
CY7C1518AV18 – 4M x 18
CY7C1520AV18 – 2M x 36
Functional Description
The CY7C1516AV18, CY7C1527AV18, CY7C1518AV18, and
CY7C1520AV18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a 1-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1516AV18
and two 9-bit words in the case of CY7C1527AV18 that burst
sequentially into or out of the device. The burst counter always
starts with a “0” internally in the case of CY7C1516AV18 and
CY7C1527AV18. On CY7C1518AV18 and CY7C1520AV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1518AV18 and two 36-bit words in the case of
CY7C1520AV18 sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
 300 MHz
 278 MHz
 250 MHz
 200 MHz
 167 MHz
Unit
Maximum Operating Frequency 
300
278
250
200
167
MHz
Maximum Operating Current 
x8
900
860
800
700
650
mA
x9
900
860
800
700
650
x18
940
860
800
700
650
x36
1080
985
900
735
650