ASUS H61M-PLUS 用户手册

This motherboard supports the Intel

®

 3rd/2nd generation Core™ i7 / i5 / i3 / Pentium

®

/ 

Celeron

®

 processors in the LGA1155 package, with iGPU, memory, and PCI Express 

controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel 

(2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics 

performance. Intel

®

 3rd/2nd generation Core™ i7 / i5 / i3 / Pentium

®

 / Celeron

®

 processors 

are among the most powerful and energy efficient CPUs in the world.

The Intel

®

 H61 Express Chipset is the latest single-chipset design to support the new 1155 

socket Intel

®

 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium

®

 / Celeron

®

 

processors. It provides improved performance by utilizing serial point-to-point links, which 

allows increased bandwidth and stability.

The motherboard supports DDR3 memory that features data transfer rates of 2200 (O.C.)/ 

2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz to meet the higher 

bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The 

dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost 

system performance.

PCI Express

® 

3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding 

schemes that provide twice the performance of the current PCIe 2.0. The total bandwidth 

for a x16 link reaches a maximum of 32Gb/s, double the 16 Gb/s of PCIe 2.0 (in x16 mode). 

As such, PCIe 3.0 provides users an unprecendented data speeds, combined with the 

convenience and seamless transition offerred by complete backward compatibility with PCIe 

1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users who wish to 

improve and optimize graphic performance, as well as have the latest technology available to 

them.

1

ASUS H61M Series

1-1