AMD 1207 用户手册
Chapter 4
Thermal Design of Custom 1U-2P Systems
27
Thermal Design Guide for Socket F (1207) Processors
32800
Rev. 3.02 3.00
August 2006
4.3.5
Thermal Interface Material
The heat sink contacts the top surface of the processor package and utilizes the thermal interface
material between the processor lid and the heat sink. AMD recommends using a high performance
grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend using phase
change materials between the heat sink and the processor. Phase-change materials develop high
adhesion forces between the heat sink and processor when the material is in the solid phase. This
strong adhesive force can cause the processor to stick to the heat sink, making heat sink removal
difficult and damaging the socket solder balls.
material between the processor lid and the heat sink. AMD recommends using a high performance
grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend using phase
change materials between the heat sink and the processor. Phase-change materials develop high
adhesion forces between the heat sink and processor when the material is in the solid phase. This
strong adhesive force can cause the processor to stick to the heat sink, making heat sink removal
difficult and damaging the socket solder balls.