TDK Memory Bus Interface Type 产品宣传页

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• All specifications are subject to change without notice.

Memory Bus Interface Type

For Small Embedded Systems without an ATA/IDE interface

NAND-type Flash Memory has occupied significant place in embedded systems. In many cases the system size is small and an ATA 

interface is not used.  The TDK GBDriver XR bridges those host interfaces without an ATA bus to NAND-type Flash Memory. The built-in 

engine is the TDK GBDriver RA3 controller.  The GBDriver RA3 is the recipient of numerous design wins and strong interest from our 

customer base. 

GBDriver XR interfaces with a common memory bus such as SRAM bus, enabling CPU to connect with and thus control NAND-type 

Flash Memory directly. GBDriver XR makes it possible to build storage systems even if they do not have hard disk interface such as ATA/

IDE. The XR is packaged in an ultra-small, ultra-thin VFBGA.  This simplifies insertion into portable devices, mobile terminals, and small 

IT home appliances.

• World’s first NAND-type Flash Memory controller interfacing with 

common memory bus, such as a one chip LSI solution.

• Realizes 6MB/s burst writes when directly connected with the 

system bus.

• Controls NAND-type Flash Memory up to 4GB. Confirmed 

compatibility with Flash Memories of several makers.

∗

• High reliability in Write and Read by TDK original systematic 

control over NAND-type Flash Memory.

• ATA compatible register interface, suitable for use with the FAT 

file system, only low level driver required.

• Available in 8mm

…

VFBGA100pin package.

• Supports auto recovery function (option)

• Conforms to the RoHS directives.

∗

Please contact us to confirm the Flash Memory compatibility.

• Flash memory modules

• Silicon storage

• Boot devices for embedded systems

• For NOR Flash-/HDD- replacement applications.

• For user data storage applications; home information 

appliances, STBs, PDAs, mobile phones, etc.

• For booting embedded systems of WindowsXP Embedded-base 

or Linux-base.

Timing specifications

Host I/F

120ns[Burst cycle]
180ns[Single cycle]

Flash I/F

90ns

Power specifications

Host I/F 

2.7 to 3.6V

Core 

2.7 to 3.6V

Flash I/F 

2.7 to 3.6V

System clock

33.33MHz
[External clock support]

Temperature ranges

Operating

–40 to +85°C

Storage

–55 to +125°C

Power consumption
(ref.)

Reading

41mA[3.0V]

Writing

40mA[3.0V]

8.0

ø

0.25

0.38

6.75

0.75

8.0

0.18 to 0.28

1.0max.

6.75

Dimensions in mm

C

Solder

ball

Detail of ball

10 9 8 7 6 5 4 3 2 1

1 2 3 4 5 6 7 8 9 10

A
B
C
D
E
F

G
H

J

K

A
B
C
D
E
F

G
H

J

K

A1 corner 
marking

A1 corner 
marking

0.10

C

100-ø0.25 to 0.35

Land & lead
Solder resist

Substrate

Opening size

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific 

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• GBDriver is a registered trademark of TDK Corporation
• CompactFlash

TM

 is a trademark of SanDisk Corporation