Renesas H8S/2111B 用户手册

Rev. 1.00, 05/04, page 539 of 544 

 

For package dimensions, dimensions described in Renesas Semiconductor Packages Data Book 
have priority. 

Package Code
JEDEC
EIAJ
Weight (reference value)

TFP-144
—
Conforms
0.6 g

Unit: mm

*Dimension including the plating thickness

Base material dimension

108

73

1

36

0

˚  – 8˚ 

0.08

0.07 M

18.0 ± 0.2

72

144

109

37

18.0 ± 0.2

*

0.18 ± 0.05

0.4

1.20 Max

1.0 

0.5 ± 0.1

16

1.00

0.10 ± 0.05

*

0.17 ± 0.05

0.16 ± 0.04

0.15 ± 0.04

1.0