Motorola MC68VZ328 用户手册
Mechanical Data and Ordering Information
20-1
Chapter 20
Mechanical Data and Ordering
Information
Information
This chapter provides mechanical data, including illustrations, and ordering information.
20.1
Ordering Information
Table 20-1 provides ordering information for the two package types: the 144-lead, plastic, thin quad flat
package (TQFP) and the 144-lead mold array process ball grid array (MAPBGA) package.
package (TQFP) and the 144-lead mold array process ball grid array (MAPBGA) package.
Table 20-1. MC68VZ328 Ordering Information
Package Type
Frequency (MHz)
Temperature
Order Number
144-lead TQFP
33
0
O
C to 70
O
C
MC68VZ328PV33V
144-lead MAPBGA
33
0
O
C to 70
O
C
MC68VZ328VF33V
144-lead TQFP
33
-40
O
C to 85
O
C
MC68VZ328CPV33V
144-lead MAPBGA
33
-40
O
C to 85
O
C
MC68VZ328CVF33V