DELL 200 用户手册
support.dell.com
Introduction
1-1
The Dell™ PowerApp™ 200 appliance is an ultra-slim, full-featured, rack-mounted,
turn-key device with an embedded operating system. Combined with innovative setup
and administrative tools and utilities, the PowerApp 200 provides specific and reliable
functionality in a rack-dense form factor.
turn-key device with an embedded operating system. Combined with innovative setup
and administrative tools and utilities, the PowerApp 200 provides specific and reliable
functionality in a rack-dense form factor.
PowerApp systems offer the following major features:
One Intel
®
Pentium
®
III microprocessor.
The Pentium III microprocessor includes MMX™ technology designed to handle
complex multimedia and communications software. This microprocessor
incorporates new instructions and data types as well as a technique called single
instruction, multiple data (SIMD) that allows the microprocessor to process
multiple data elements in parallel, thereby improving overall system performance.
complex multimedia and communications software. This microprocessor
incorporates new instructions and data types as well as a technique called single
instruction, multiple data (SIMD) that allows the microprocessor to process
multiple data elements in parallel, thereby improving overall system performance.
A secondary level 2 (L2) cache of static random-access memory (SRAM) is
included within the single-edge contact (SEC) cartridge that contains the
microprocessor. Math coprocessor functions are provided by the microprocessor.
A separate and external math coprocessor chip is not used or required.
included within the single-edge contact (SEC) cartridge that contains the
microprocessor. Math coprocessor functions are provided by the microprocessor.
A separate and external math coprocessor chip is not used or required.
The size of the L2 cache is dependent on the processor installed in the system.
Front side bus (FSB) with an external bus speed of 133 megahertz (MHz).
A minimum of 512 megabytes (MB) of system memory, with a maximum of 2
gigabytes (GB) installed in combinations of 128-MB, 512-MB, 1-GB, or 2-GB regis-
tered synchronous dynamic RAM (SDRAM) dual in-line memory modules
(DIMMs) in the four DIMM sockets on the system board.
gigabytes (GB) installed in combinations of 128-MB, 512-MB, 1-GB, or 2-GB regis-
tered synchronous dynamic RAM (SDRAM) dual in-line memory modules
(DIMMs) in the four DIMM sockets on the system board.
A basic input/output system (BIOS) that resides in flash memory on the Periph-
eral Component Interconnect (PCI) bus.
eral Component Interconnect (PCI) bus.
Support for up to four 1-inch, hot-pluggable small computer system interface
(SCSI) hard-disk drives. One additional 1-inch hard-disk drive can be installed in
the optional removable media bay.
(SCSI) hard-disk drives. One additional 1-inch hard-disk drive can be installed in
the optional removable media bay.