Husqvarna PG530 用户手册

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Diamonds
Background
Diamond abrasives usually consist of 2 components:
1. Diamond powder (also known as diamond crystals 
  or grit). By changing the size of the diamond powder 
  or grit, we can change how coarse or fi ne the 
  scratches will be that are left behind from the 
 grinding 
process.
2. A binding agent (metal or resin). Diamond powder 
  is mixed and suspended in either a metal or resin 
  binding agent. When suspended in a metal binding 
 agent, 
the 
fi nished product is referred to as a Metal 
  Bond or Sintered diamond segment. When sus-
pended 
  in a resin binding agent, the fi nished product is 
  referred to as a Resin Bond diamond segment or 
  pad. By changing the hardness of the binding agent, 
  we can change how fast or slow the diamond abra-
sive   
 will 
wear.
General Principles
The following are general rules regarding diamond 
segments in grinding applications. As with all general 
rules there are exceptions or cases when it is not the 
case.
DIAMOND GRIT SIZE
Changing the size of the diamond grit to a smaller par-
ticle/grit size will effect the performance of the diamond 
tool in the following ways:
Create a fi ner scratch pattern.
Increase the life of the diamond tool.
The opposite will occur when changing to a larger 
particle /grit size.
BINDING AGENT—METAL BOND OR RESIN BOND
Increasing hardness of bond will:
Increase life of diamond tool.
Decrease production rate.
Cause diamond tool to leave fi ner scratches in dry 
- grinding applications (when compared to a softer 
bond diamond tool with the same diamond grit 
size).
The opposite will occur when making the metal or resin 
bond softer.
NUMBER OF DIAMOND SEGMENTS/PADS UNDER 
THE MACHINE
Increasing the number of segments under the machine 
will:
Reduce pressure on each individual diamond seg-
ment.-  Reduce  wear  rate  on  diamond  segments.         
Reduce load on the machine and cause the grinder 
to draw less current.
Create a smoother scratch pattern (particularly on 
soft fl oors).
The opposite will occur when decreasing the number 
of segments under the machine.
WET AND DRY GRINDING
When using diamond segments wet, the following 
principles apply:
Production rates will be higher than dry grinding.
Diamond segments will wear faster (due to pres-
ence of slurry) and therefore, harder bonds can be 
used  
(when comparing with dry grinding).
Scratches from diamond grit will be deeper.
When using diamond segments dry, the following 
principles apply:
Production rates will be slower on harder materials 
than if wet grinding.
Softer bond segments will be required in order to 
encourage segment wear (as there will be not slurry 
to help diamond segments to wear).
Scratches from diamond grit will not be as deep 
compared to if it were also used for wet grinding.
There will be more heat generated by the diamond 
segment.
Summary of diamond principles
Diamond segments need to wear in order to achieve 
productivity. Diamond segment wear can be infl uenced 
by the following factors:
Pressure.
Hardness of bond.
Diamond grit size.
Diamonds