Fujifilm Xeon 5110 S26361-F3243-L160 数据表
产品代码
S26361-F3243-L160
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
79
Thermal Specifications
Notes:
1.
for discrete points that constitute the thermal profile.
2.
Refer to the Dual-Core Intel
®
Xeon
®
Processor 5100 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
. The processor may be shipped under
multiple VIDs for each frequency.
Figure 6-3. Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon®
Processor LV 5128 Thermal Profile
TCASE_MAX@TDP
45
47
49
51
53
55
57
59
20
22
24
26
28
30
32
34
36
38
40
Power [W]
T
e
m
p
er
at
u
re [
C
]
Y = 0.450*x +40.0
TCASE_MAX@TDP
45
47
49
51
53
55
57
59
20
22
24
26
28
30
32
34
36
38
40
Power [W]
T
e
m
p
er
at
u
re [
C
]
Y = 0.450*x +40.0
Table 6-7.
Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon®
Processor LV 5128 Thermal Profile Table
Power (W)
T
CASE_MAX
(°C)
P
_PROFILE_MIN
=22.2
50.0
25
51.3
30
53.5
35
55.8
40
58.0
Table 6-8.
Dual-Core Intel® Xeon® Processor 5160 Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
90
65
5
See
1, 2, 3, 4, 5, 6,
7