Intel E8200 BX80570E8200A 用户手册

Intel

产品代码

BX80570E8200A

4

Thermal and Mechanical Design Guidelines

On-Demand Mode ...................................................................37

System Considerations.............................................................37

Operating System and Application Software Considerations ...........38

THERMTRIP# Signal.................................................................38

Cooling System Failure Warning ................................................38

Digital Thermal Sensor.............................................................38

Platform Environmental Control Interface (PECI)..........................39

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41

Overview of the BTX Reference Design ....................................................41

Target Heatsink Performance ....................................................41

Acoustics ...............................................................................42

Effective Fan Curve .................................................................43

Voltage Regulator Thermal Management.....................................44

Altitude..................................................................................45

Reference Heatsink Thermal Validation .......................................45

Environmental Reliability Testing ............................................................45

Structural Reliability Testing .....................................................45

Random Vibration Test Procedure................................45

Shock Test Procedure ................................................46

Power Cycling .........................................................................47

Recommended BIOS/CPU/Memory Test Procedures ......................48

Material and Recycling Requirements ......................................................48

Safety Requirements ............................................................................49

Geometric Envelope for Intel Reference BTX Thermal Module Assembly........49

Preload and TMA Stiffness .....................................................................50

Structural Design Strategy........................................................50

TMA Preload verse Stiffness ......................................................50

ATX Thermal/Mechanical Design Information.......................................................53

ATX Reference Design Requirements .......................................................53

Validation Results for Reference Design ...................................................55

Heatsink Performance ..............................................................55

Acoustics ...............................................................................56

Altitude..................................................................................56

Heatsink Thermal Validation .....................................................57

Environmental Reliability Testing ............................................................57

Structural Reliability Testing .....................................................57

Random Vibration Test Procedure................................57

Shock Test Procedure ................................................58

Power Cycling .........................................................................59

Recommended BIOS/CPU/Memory Test Procedures ......................60

Material and Recycling Requirements ......................................................60

Safety Requirements ............................................................................61

Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......61

Reference Attach Mechanism..................................................................62

Structural Design Strategy........................................................62

Mechanical Interface to the Reference Attach Mechanism ..............63

Quiet System Technology (Intel

QST) .....................................................65

QST Algorithm ............................................................................65

Output Weighting Matrix ..........................................................66

Proportional-Integral-Derivative (PID) ........................................66