Intel E8200 BX80570E8200A 用户手册
产品代码
BX80570E8200A
Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
15
2
Processor Thermal/Mechanical
Information
Information
2.1
Mechanical Requirements
2.1.1
Processor Package
The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet
for detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure
for illustration only. Refer to the processor datasheet for further information. In case
of conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.
Figure
2-1. Package IHS Load Areas
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te