Intel 945P 用户手册

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Thermal and Mechanical Design Guidelines 

To determine TDP for pre-silicon products in development, it is necessary to make 

estimates based on analytical models. These models rely on extensive knowledge of 

the past chipset power dissipation behavior along with knowledge of planned 

architectural and process changes that may affect TDP. Knowledge of applications 

available today and their ability to stress various components of the chipset is also 

included in the model. Since the number of applications available today is beyond 

what Intel can test, only real world high-power applications are tested to predict TDP. 

The values determined are used to set specific data transfer rates. The projection for 

TDP assumes (G)MCH operation at T

C-MAX

. The TDP estimate also includes a margin to 

account for process variation.  

Once the product silicon is available, post-silicon validation is performed to assess the 

validity of pre-silicon projections. Testing is performed on both commercially available 

and synthetic high power applications and power data is compared to pre-silicon 

estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP 

estimates. 

Designing to the TDP can ensure that a particular thermal solution meets the cooling 

needs of future applications. Testing with currently available commercial applications 

has shown that the components may dissipate power levels below the published TDP 
specification in Section 

2.4.3. Intel strongly recommends that thermal engineers 

design to the published TDP specification to develop a robust thermal solution that will 

meet the needs of current and future applications. 

The (G)MCH is estimated to dissipate the Thermal Design Power values provided in 

Table 3 when using two DIMMs of 667 MHz (553 MHz for the 82945PL/82945GZ) dual 

channel DDR2 with a 1066 MHz (800 MHz for the 82945PL/82945GZ/82945GC) 

processor system bus speed. For the 82945G/82945GZ/82945GC GMCH, the graphics 

core is assumed to run at 400 MHz. FC-BGA packages have limited heat transfer 

capability into the board and have minimal thermal capability without thermal 

solutions. Intel requires that system designers plan for an attached heatsink when 

using the (G)MCH.  

82945G GMCH  

1066 MHz 

667 MHz 

22.2 W 

82945GZ GMCH 

800 MHz 

533 MHz 

22.2 W 

82945GC GMCH 

800 MHz 

667 MHz 

22.2 W 

82945P MCH 

1066 MHz 

667 MHz 

15.2 W 

82945PL MCH 

800 MHz 

533 MHz 

15.2 W 

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