Intel Xeon Wolfdale E3210 P4X-UPE3210-316-6M1333 数据表
产品代码
P4X-UPE3210-316-6M1333
Datasheet
313
Ballout and Package Information
12.2
Package Information
The MCH is available in a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball Grid Array
(FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder balls.
shows the package dimensions.
Figure 15.
MCH Package Drawing