Intel 220 LE80557RE009512 数据表
产品代码
LE80557RE009512
4
Datasheet
Thermal Monitor.......................................................................................64
Figures
Processor Low Power State Machine ............................................................................14
Static and Transient Tolerance .............................................................................25
Overshoot Example Waveform..............................................................................26
Tables
Absolute Maximum and Minimum Ratings ....................................................................23
Static and Transient Tolerance .............................................................................25
Overshoot Specifications......................................................................................26
Signal Characteristics................................................................................................29
10 Signal Reference Voltages .........................................................................................29
11 GTL+ Signal Group DC Specifications ..........................................................................30
12 Open Drain and TAP Output Signal Group DC Specifications ...........................................30
13 CMOS Signal Group DC Specifications..........................................................................31
14 GTL Bus Voltage Definitions .......................................................................................31
15 Core Frequency to FSB Multiplier Configuration.............................................................32
16 Micro-FCBGA Package Mechanical Specifications ...........................................................34
17 Pin Listing by Pin Name .............................................................................................40
18 Pin Listing by Pin Number ..........................................................................................46
19 Signal Description.....................................................................................................52
20 Processor Thermal Specifications ................................................................................61
11 GTL+ Signal Group DC Specifications ..........................................................................30
12 Open Drain and TAP Output Signal Group DC Specifications ...........................................30
13 CMOS Signal Group DC Specifications..........................................................................31
14 GTL Bus Voltage Definitions .......................................................................................31
15 Core Frequency to FSB Multiplier Configuration.............................................................32
16 Micro-FCBGA Package Mechanical Specifications ...........................................................34
17 Pin Listing by Pin Name .............................................................................................40
18 Pin Listing by Pin Number ..........................................................................................46
19 Signal Description.....................................................................................................52
20 Processor Thermal Specifications ................................................................................61