Intel 220 LE80557RE009512 数据表

Datasheet

61

A complete thermal solution includes both component and system level thermal 

management features. The Celeron processor requires a thermal solution to maintain 

temperatures within operating limits. 

Any attempt to operate the processor outside operating limits may result in permanent 

damage to the processor and potentially other components in the system. 

The system/processor thermal solution should remain within the minimum and 

maximum junction temperature (Tj) specifications at the corresponding thermal design 

power (TDP) value listed in 

For more information on designing a component level thermal solution, refer to the 

®

®

 Processor 200 Sequence Thermal and Mechanical Design Guidelines.

To allow for the optimal operation and long-term reliability of Intel processor-based 

systems, the system/processor thermal solution should be designed such that the 

processor remains within the minimum and maximum junction temperature (T

J

) 

specifications when operating at or below the Thermal Design Power (TDP) value listed 

per frequency in 

. Thermal solutions not designed to provide this level of 

thermal capability may affect the long-term reliability of the processor and system. For 

more details on thermal solution design, refer to the Intel

®

®

Sequence Thermal and Mechanical Design Guidelines.

The junction temperature is defined at the geometric top center of the processor. 

Analysis indicates that real applications are unlikely to cause the processor to consume 

maximum power dissipation for sustained time periods. Intel recommends that 

complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor power consumption. The Thermal Monitor 

feature is designed to protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained periods of time. For more details on 

the usage of this feature, refer to 

. In all cases the Thermal Monitor feature 

must be enabled for the processor to remain within specification.

NOTES:
1.

The TDP specification should be used to design the processor thermal solution. The TDP is 
not the maximum theoretical power the processor can generate. 

2.

Not 100% tested. These power specifications are determined by characterization of the 
processor currents at higher temperatures and extrapolating the values for the 
temperature indicated.

3.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal 
Monitor’s automatic mode is used to indicate that the maximum T

J

 has been reached. 

4.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate 
within specifications.

5.

At Tj of 100 °C.

TDP

220

1.20 GHz

512 KB

19

W

1,4,5

T

J

Junction Temperature

0

100

°C

3,4