Intel LF80550KG0804M 数据表
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
125
Boxed Processor Specifications
8.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weight is approximately 530 grams. See
document for details on the processor weight and the Dual-Core Intel® Xeon®
Processor 7100 Series Thermal/Mechanical Design Guidelines for the enabled heatsink
requirements.
Processor 7100 Series Thermal/Mechanical Design Guidelines for the enabled heatsink
requirements.
8.2.3
Boxed Processor Retention Mechanism and Heatsink
Supports
Baseboards and chassis’s designed for use by system integrators should include holes
that are in proper alignment with each other to support the boxed processor. See
that are in proper alignment with each other to support the boxed processor. See
for example of processor pitch and layout.
illustrates the retention solution. This is designed to extend air-cooling
capability through the use of larger heatsinks with minimal airflow blockage and
minimal bypass. These retention mechanisms can allow the use of much heavier
heatsink masses compared to legacy solution limitations by using a load path attached
to the chassis pan. The CEK spring on the under side of the baseboard provides the
necessary compressive load for the thermal interface material. The baseboard is
intended to be isolated such that the dynamic loads from the heatsink are transferred
to the chassis pan via the heatsink screws and heatsink standoffs. This reduces the risk
of package pullout and solder joint failures in a shock and vibe situation.
minimal bypass. These retention mechanisms can allow the use of much heavier
heatsink masses compared to legacy solution limitations by using a load path attached
to the chassis pan. The CEK spring on the under side of the baseboard provides the
necessary compressive load for the thermal interface material. The baseboard is
intended to be isolated such that the dynamic loads from the heatsink are transferred
to the chassis pan via the heatsink screws and heatsink standoffs. This reduces the risk
of package pullout and solder joint failures in a shock and vibe situation.
The assembly requires larger diameter holes to compensate for the CEK spring
embosses. See
embosses. See
for processor mounting thru holes. For
further details on the solution, refer to the Dual-Core Intel® Xeon® Processor 7100
Series Thermal/Mechanical Design Guidelines.
Series Thermal/Mechanical Design Guidelines.
8.3
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the
boxed processor.
boxed processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor will be cooled by forcing ducted chassis fan airflow through the
passive heat sink solution. Meeting the processor’s temperature specifications is a
function of the thermal design of the entire system, and ultimately the responsibility of
the system integrator. The processor temperature specification is found in
passive heat sink solution. Meeting the processor’s temperature specifications is a
function of the thermal design of the entire system, and ultimately the responsibility of
the system integrator. The processor temperature specification is found in
of
this document. For the boxed processor passive heatsink to operate properly, chassis
air movement devices are required. Necessary airflow and associated flow impedance is
29 cfm at 0.14” H
air movement devices are required. Necessary airflow and associated flow impedance is
29 cfm at 0.14” H
2
O.
In addition, the processor pitch should be 3.25 inches, or slightly more, when placed in
side by side orientation.
side by side orientation.
illustrates the side by side orientation and pitch.
Note that the heatsinks are interleaved to reduce air bypass.
It is also recommended that the ambient air temperature outside of the chassis be kept
at or below 35 °C. The air passing directly over the processor heatsink should not be
preheated by other system components (such as another processor), and should be
kept at or below 40 °C. Again, meeting the processor’s temperature specification is the
responsibility of the system integrator.
at or below 35 °C. The air passing directly over the processor heatsink should not be
preheated by other system components (such as another processor), and should be
kept at or below 40 °C. Again, meeting the processor’s temperature specification is the
responsibility of the system integrator.