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Intel® Server System SR1695GPRX TPS 
Introduction 
Revision 1.5 
 
 
 
Intel order number: G11332-006 
1. Introduction 
This Technical Product Specification (TPS) provides system specific information detailing the 
features, functionality, and high-level architecture of the Intel
®
 Server System SR1695GPRX. 
You should also reference the Intel
® 
Server Board S3420GPRX Technical Product Specification 
to obtain greater detail of functionality and architecture of the server board integrated in this 
server system. 
In addition, you can obtain design-level information for specific sub-systems by ordering the 
External Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-
system. EPS and EDS documents are not publicly available. They are only made available 
under NDA with Intel
®
 and must be ordered through your local Intel
®
 representative. For a 
complete list of available documents, refer to the Reference Documents section at the end of 
this document. 
The Intel
®
 Server System SR1695GPRX may contain design defects or errors known as errata 
which may cause the product to deviate from published specifications. Refer to the Intel
®
 Server 
Board S3420GPRX/Intel
®
 Server System SR1695GPRX Specification Update for 
published errata. 
1.1 
Chapter Outline 
This document is divided into the following chapters: 
ƒ
  Chapter 1 – Introduction 
ƒ
  Chapter 2 – Product Overview 
ƒ
  Chapter 3 – Power Sub-System 
ƒ
  Chapter 4 – Cooling Sub-System 
ƒ
  Chapter 5 – Peripheral Drive Support 
ƒ
  Chapter 6 – Hard Disk Drive Support 
ƒ
  Chapter 7 – Front Panel Control and Indicators 
ƒ
  Chapter 8 – Configuration Jumpers 
ƒ
  Chapter 9 – PCI Riser Card and Assembly 
ƒ
  Chapter 10 – Environmental and Regulatory Specifications 
ƒ
  Appendix A – Integration and Usage Tips 
ƒ
  Appendix B – POST code LED Decoder 
ƒ
  Appendix C – Video POST Code Errors 
ƒ
 Glossary 
ƒ
 Reference 
Documents 
 
1.2 
Server Board Use Disclaimer 
Intel Corporation server boards support add-in peripherals and contain a number of high-density 
VLSI and power delivery components that need adequate airflow to cool. Intel
®
 ensures through 
its own chassis development and testing that when Intel
®
 server building blocks are used 
together, the fully integrated system will meet the intended thermal requirements of these