ASUS lx plus desktop motherboard m5a78l-m lx plus 用户手册
DDR3-1333 MHz capability
Vendor
Part No.
Size
SS/
DS
Brand Chip NO.
Timing
DIMM
(BIOS)
Voltage
DIMM
Support
A* B*
G.SKILL
F3-10600CL8D-2GBHK
1024MB
SS G.SKILL Heat-Sink Package
•
G.SKILL
F3-10600CL9D-2GBPK
1024MB
SS G.SKILL Heat-Sink Package
•
•
G.SKILL
F3-10666CL7T-3GBPK
3072MB(Kit of 3) SS
N/A
Heat-Sink Package
7-7-7-18 1.5~1.6V
•
•
G.SKILL
F3-10666CL9T-3GBNQ
3072MB(Kit of 3) SS
N/A
Heat-Sink Package
9-9-9-24 1.5~1.6V
•
•
G.SKILL
F3-10600CL7D-2GBPI
1024MB
DS G.SKILL Heat-Sink Package
•
•
G.SKILL
F3-10600CL9D-2GBNQ
1024MB
DS G.SKILL Heat-Sink Package
•
G.SkiLL
F3-10666CL8D-4GBHK
4096MB(Kit of 2 ) DS
N/A
Heat-Sink Package
8-8-8-21 1.5-1.6V
•
•
G.SKILL
F3-10666CL7T-6GBPK
6144MB(Kit of 3 ) DS
N/A
Heat-Sink Package
7-7-7-18 1.5~1.6V
•
•
G.SKILL
F3-10666CL9T-6GBNQ
6144MB(Kit of 3) DS
N/A
Heat-Sink Package
9-9-9-24 1.5V~1.6V •
•
GEIL
DDR3-1333 CL9-9-9-24
1024MB
SS
N/A
Heat-Sink Package
9
•
•
GEIL
GV34GB1333C7DC
2048MB
DS
N/A
Heat-Sink Package
7-7-7-24
1.5V
•
•
GEIL
GG34GB1333C9DC
4096MB(Kit of 2) DS
GEIL
GL1L128M88BA12N
9-9-9-24 1.3V(low
voltage)
•
•
GEIL
DDR3-1333 CL9-9-9-24
6144MB(Kit of 3 ) DS
N/A
Heat-Sink Package
9
1.5V
•
•
Kingmax
FLFD45F-B8MH9 MAES
1024MB
SS
Micron 9CF22D9KPT
•
•
Kingmax
FLFE85F-B8MF9
2048MB
DS
Micron 8HD22D9JNM
•
•
Kingmax
FLFE85F-B8MH9 MEES
2048MB
DS
Micron 9GF27D9KPT
•
•
Kingston
KVR1333D3N9/1G
1024MB
SS
Hynix
H5TQ1G83BFR
9
1.5V
•
•
Kingston
KVR1333D3N9/2G
2048MB
DS Qimonda IDSH1G-03A1F1C-13H
1.5V
•
•
Micron
MT8JTF12864AY-1G4D1
1024MB
SS
Micron 8LD22D9JNM
•
•
Micron
MT8JTF12864AZ-1G4F1
1024MB
SS
Micron 9FF22D9KPT
9
•
•
Micron
MT9JSF 12872AZ-1G4F1
1024MB
SS
Micron 91F22D9KPT(ECC)
9
•
•
Micron
MT8JTF12864AY-1G4D1
3072MB(Kit of 3) SS
Micron 8XD22D9JNM
9
•
•
Micron
MT12JSF25672AZ-1G4F1
2048MB
DS
Micron 91F22D9KPT(ECC)
9
•
•
Micron
MT16JTF25664AY-1G1D1
2048MB
DS
Micron 8LD22 D9JNM
•
•
Micron
MT18JTF25664AZ-1G4F1
2048MB
DS
Micron 9KF27D9KPT
9
•
•
Micron
MT16JTF25664AY-1G4D1
6144MB(Kit of 3 ) DS
Micron 8UD22D9JNM
9
•
•
OCZ
OCZ3X1333LV3GK(XMP)
3072MB(Kit of 3) SS
N/A
Heat-Sink Package
1.6V
•
OCZ
OCZ3G13334GK
4096MB(Kit of 2) DS
N/A
Heat-Sink Package
1.7V
•
•
OCZ
OCZ3P13334GK
4096MB(Kit of 2) DS
N/A
Heat-Sink Package
7-7-7-20
1.8V
•
•
OCZ
OCZ3G1333LV6GK
6144MB(Kit of 3 ) DS
N/A
Heat-Sink Package
9-9-9-20
1.65V
•
•
OCZ
OCZ3P1333LV6GK
6144MB(Kit of 3 ) DS
N/A
Heat-Sink Package
7-7-7-20
1.65V
•
•
OCZ
OCZ3X1333LV6GK(XMP)
6144MB(Kit of 3 ) DS
N/A
Heat-Sink Package
8-8-8-20
1.60V
•
•
SAMSUNG M378B2873DZ1-CH9
1024MB
SS Samsung K4B1G0846D-HCH9
•
•
SAMSUNG M378B2873DZ1-CH9
1024MB
SS Samsung SEC 846 HCH9 K4B1G08460
•
•
SAMSUNG M378B2873EH1-CH9
1024MB
SS Samsung SEC 913 HCH9 K4B1G0846E
•
•
SAMSUNG M391B2873DZ1-CH9
1024MB
SS Samsung K4B1G0846D-HCH9(ECC)
•
•
SAMSUNG M378B5673DZ1-CH9
2048MB
DS Samsung K4B1G0846D-HCH9
•
•
SAMSUNG M378B5673EH1-CH9
2048MB
DS Samsung SEC 913 HCH9 K4B1G0846E
•
•
SAMSUNG M391B5673DZ1-CH9
2048MB
DS Samsung K4B1G0846D-HCH9(ECC)
•
•
Super Talent W1333X2GB8
1024MB
SS
N/A
Heat-Sink Package
•
•
Transcend
TS128MLK64V3U
1024MB
SS
N/A
SEC 813HCH9 K4B1G0846D
•
•
Transcend
TS128MLK72V3U
1024MB
SS
N/A
K4B1G0846D(ECC)
•
•
Transcend
TS256MLK64V3U
2048MB
DS
Micron 9GF27D9KPT
•
•
Transcend
TS256MLK64V3U
2048MB
DS
N/A
SEC816HCH9K4B1G0846D
•
•
Chapter 1: Product introduction
1-14