3M gold finger masking for wave solder or solder reflow processes 用户手册
Application Profile
3M Industrial Markets
Market: Printed Circuit Board Assembly
Application Description: Gold Finger Masking for Wave Solder or Solder
Reflow Processes.
Application Description: Gold Finger Masking for Wave Solder or Solder
Reflow Processes.
PRODUCT
3M
™
Non-Silicone High
Temperature Masking Tape 5563
Application Type
Gold Finger Protecting
LGA Pad Protecting
Press Fit Connector Protecting
LGA Pad Protecting
Press Fit Connector Protecting
Application Method
Typically done manually. Die cut parts may also be used for a Land Grid
Array (LGA) application.
• Note: Special handling processes, see application tips.
Array (LGA) application.
• Note: Special handling processes, see application tips.
Key Application Requirements
High temperature resistance: 200°C for continuous use as tested on SiO
2
wafers with no adhesive transfer; one hour at 250°C exposure with no adhesive
transfer on PC Boards.
Where there is concern about static charge generation during unwind and
removal of tape, clean removal or silicone residue contamination left on
masked areas.
transfer on PC Boards.
Where there is concern about static charge generation during unwind and
removal of tape, clean removal or silicone residue contamination left on
masked areas.
Product Replaced
High temperature board processing tapes that leave residue or cause silicone
contamination.
contamination.
Benefits/Advantages To Customer
Static safe polyimide: Static disipative coated backing virtually eliminates wire
board component degradation due to electrostatic discharge from the tape. This
helps reduce costly board waste due to component failure.
board component degradation due to electrostatic discharge from the tape. This
helps reduce costly board waste due to component failure.
Temperature resistant: Acrylic adhesive resists high temperatures, minimizing
contamination from adhesives (typically silicone) that may cause disconnect
and/or corrosion of connecting parts.
contamination from adhesives (typically silicone) that may cause disconnect
and/or corrosion of connecting parts.
Clean removal: Excellent adhesive anchorage to backing eliminates expensive
clean-up after soldering process.
clean-up after soldering process.
Available as die-cut parts: Tape may be die-cut into custom shapes and sizes
by a converter to allow for masking of precise shapes like LGA sockets.
by a converter to allow for masking of precise shapes like LGA sockets.