Nokia 2600 服务手册
ISSUE 1 09/2004
COMPANY CONFIDENTIAL
19
Copyright © 2004 Nokia. All Rights Reserved.
RH-59/60
7-System Module
Nokia Customer Care
Functional Description
■
Audio external
Nokia 2600 is designed to support fully differential external audio accessory connection. A
headset and PnPHF can be directly connected to system connector.
headset and PnPHF can be directly connected to system connector.
Figure 3:Headset Interface
Headset accessory uses 4-wire fully differential audio connection.
Audio internal
Earpiece
The earpiece selected is a 8-mm dynamic earpiece from PSS with a nominal impedance of 32
W. The earpiece acoustics will be designed to be type approved by type 3.2, low leak artificial
ear (Ear Simulator Type 4195, Low Leakage).
W. The earpiece acoustics will be designed to be type approved by type 3.2, low leak artificial
ear (Ear Simulator Type 4195, Low Leakage).
The earpiece will be mounted into the UI-shield assembly, the sealing of the back and front vol-
ume will be implemented in the UI-shield by die casting. This sealing part will also provide the
sealing against the A-cover.
ume will be implemented in the UI-shield by die casting. This sealing part will also provide the
sealing against the A-cover.
To achieve a small dynamic range of the earpiece frequency response, a helmholtz resonator
is implemented in front of the speaker membrane, the resonance frequency of the helmholtz
resonator is approximately 4 kHz.
is implemented in front of the speaker membrane, the resonance frequency of the helmholtz
resonator is approximately 4 kHz.
To improve the leak tolerance of the earpiece design leak holes will be implemented. The holes
will provide a leak from the A-cover to the internal phone volume.
will provide a leak from the A-cover to the internal phone volume.
Dust and water shield is used to reduce the total dynamics of the frequency response by atten-
uating the resonance, it will also protect the earpiece from pollution with dust and swarfs.
uating the resonance, it will also protect the earpiece from pollution with dust and swarfs.
1k0
Hookint
Headint
Headint
EAD
MICB2
MIC2P
MIC2N
33N
HFCM
HF
Bottom
Connector
Connector
UEM
2.1V
2.7V
33N
1k0
/MBUS
MicGnd
1.8V
0.3V
0.8V
3...25k
Mic_bias
0.8V
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