Intel BLKDH67CF 用户手册
PRoCeSSoR
Processor Support
• Intel® Core™ i5, Intel® Core™ i3, and other
• Intel® Core™ i5, Intel® Core™ i3, and other
Intel® processors in the LGA1155 package
1
• Supports Intel® 64 architecture
8
CHIPSeT
Intel® H67 Express Chipset
• Intel® 82H67 Platform Controller Hub (PCH)
• Intel® 82H67 Platform Controller Hub (PCH)
PeRIPHeRAL CoNNeCTIVITy
• Two SATA 6.0 Gb/s ports
• Two SATA 3.0 Gb/s ports with one SATA port
• Two SATA 3.0 Gb/s ports with one SATA port
compatible with eSATA extension
• Two SuperSpeed USB 3.0 ports with 5.0 Gb/s
link speed
• Ten Hi-Speed USB 2.0 ports (Four back panel ports
and six additional ports via four internal headers)
SySTeM bIoS
• 32 MB Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play
• Advanced configuration and power interface
V3.0b, SMBIOS 2.5
• Intel® Express BIOS update support
HARDwARe MANAGeMeNT feATuReS
• Processor fan speed control
• Front and rear system chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management support
• Front and rear system chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management support
Intel® Desktop Board DH67CF Media Series
Technical Specifications
INTeL® PRo 10/100/1000
NeTwoRk CoNNeCTIoN
NeTwoRk CoNNeCTIoN
• Low-power design
eXPANSIoN CAPAbILITIeS
• One PCI Express* 2.0 x16 connector
AuDIo
• 7.1 + 2 multi-streaming Intel® High Definition Audio
5
• Five stack analog audio ports and one optical S/PDIF
out port
• Internal S/PDIF header and front panel audio header
VIDeo
• DVI-I + HDMI*+DisplayPort*
6
: supports dual
independent display
SySTeM MeMoRy
Memory Capacity
• Two 240-pin DIMM connectors supporting
• Two 240-pin DIMM connectors supporting
up to two double-sided DIMMs
• Maximum system memory up to 16 GB
4
using 8 GB double-sided DIMMs
Memory Types
• DDR3 1333/1066 SDRAM memory support
• Non-ECC Memory
• Dual- or single-channel operation support
Memory Voltage
• Memory voltage control from 1.2 V to 1.8 V
• 1.5 V standard JEDEC voltage
• Non-ECC Memory
• Dual- or single-channel operation support
Memory Voltage
• Memory voltage control from 1.2 V to 1.8 V
• 1.5 V standard JEDEC voltage
JuMPeRS AND fRoNT PANeL CoNNeCToRS
Jumpers
• Jumper access for BIOS maintenance mode
• Jumper access for BIOS maintenance mode
Front Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Front-panel audio header
Other Connectors
• Consumer IR emitter/receiver headers
• Chassis intrusion detect header
• Front-panel audio header
Other Connectors
• Consumer IR emitter/receiver headers
• Chassis intrusion detect header
MeCHANICAL
Board Style
• Mini-ITX
Board Size
• 6.7¨ x 6.7¨ (17.2 cm x 17.2 cm)
Baseboard Power Requirements
• ATX 12 V
• Mini-ITX
Board Size
• 6.7¨ x 6.7¨ (17.2 cm x 17.2 cm)
Baseboard Power Requirements
• ATX 12 V
eNVIRoNMeNT
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -20° C to +70° C
• 0° C to +55° C
Storage Temperature
• -20° C to +70° C
ReGuLATIoNS AND SAfeTy STANDARDS
United States
UL 60950-1
Canada
CAN / CSA-C22.2 No. 60950-1
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
International
IEC 60950-1
UL 60950-1
Canada
CAN / CSA-C22.2 No. 60950-1
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
International
IEC 60950-1
eMC Regulations (Class b)
United States
FCC CFR Title 47, Chapter I, Part 15, Subparts A/B
Canada
ICES-003
Europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia/New Zealand
EN 55022
Japan
VCCI V-3, V-4
South Korea
KN-22 and KN-24
Taiwan
CNS 13438
International
CISPR 22
environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
WEEE (Directive 2002/96/EC)
China
China RoHS (MII Order # 39)
United States
FCC CFR Title 47, Chapter I, Part 15, Subparts A/B
Canada
ICES-003
Europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia/New Zealand
EN 55022
Japan
VCCI V-3, V-4
South Korea
KN-22 and KN-24
Taiwan
CNS 13438
International
CISPR 22
environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
WEEE (Directive 2002/96/EC)
China
China RoHS (MII Order # 39)
For ordering information, visit:
www.intel.com
For the most current product
information, visit:
http://developer.intel.com/
products/desktop/motherboard/
1
Using the Intel
®
Desktop Board DH67CF with a 95W TDP Core and the
supplied standard Intel thermal solution may not meet thermal requirements
if used in a mini-ITX chassis. For specific processor compatibility, please visit
http://processormatch.intel.com.
2
Intel
®
Turbo Boost Technology—maximum single-core turbo frequency
(GHz). Intel Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technology
performance varies depending on hardware, software, and overall system
configuration. Check with your PC manufacturer on whether your system
delivers Intel Turbo Boost Technology. See www.intel.com/technology/
turboboost for more information.
3
Intel
®
Hyper-Threading Technology requires a computer system with a
processor supporting HT Technology and an HT Technology-enabled
chipset, BIOS, and operating system. Performance will vary depending
on the specific hardware and software you use. See www.intel.com/info/
hyperthreading for more information.
4
System resources and hardware (such as PCI and PCI Express*) require
physical memory address locations that can reduce available addressable
system memory. This could result in a reduction of as much as 1 GB or more
of physical addressable memory being available to the operating system and
applications, depending on the system configuration and operating system.
5
Intel
®
High Definition Audio requires a system with an appropriate
Intel
®
chipset and a motherboard with an appropriate codec and the
necessary drivers installed. System sound quality will vary depending
on actual implementation, controller, codec, drivers, and speakers. For more
information about Intel
®
HD Audio, refer to www.intel.com/design/chipsets/
hdaudio.htm
6
DisplayPort (DP): The next generation in high-performance digital
connectivity, delivering high-resolution digital display and digital audio.
7
The Intel
®
Core Utilities Bundle includes Intel
®
Integrator Assistant, Intel
®
Integrator Toolkit, Intel
®
Express Installer, and Intel
®
Express BIOS Update.
8
64-bit computing on Intel
®
architecture requires a computer system with a
processor, chipset, BIOS, operating system, device drivers, and applications
enabled for Intel
®
64 architecture. Processors will not operate (including 32-bit
operation) without an Intel 64 architecture-enabled BIOS. Performance
will vary depending on your hardware and software configurations. See
http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANT-
ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Actual Intel
®
Desktop Board may differ from the image on the box.
Intel products are not intended for use in medical, life-saving, or life-
sustaining applications. Intel may make changes to specifications
and product descriptions at any time, without notice. All products and
dates specified are preliminary based on current expectations and
are subject to change without notice. Availability in different channels
may vary.
Copyright © 2010 Intel Corporation. All rights reserved. Intel, the Intel
logo, and Intel Core are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
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