Fujitsu MHV2100BH 用户手册
Index
IN-6
C141-E224
specification summary ............................... 1-4
spindle........................................................ 4-2
spindle motor ............................................. 2-2
spindle motor control............................... 4-20
spindle motor control circuit.................... 4-14
spindle motor driver circuit ....................... 4-3
stable rotation mode................................. 4-20
staggered spin-up ..................................... 5-11
standard value, surface temperature........... 3-6
STANDBY .............................................. 5-47
STANDBY IMMEDIAT ......................... 5-45
standby mode............................................. 6-9
start mode ................................................ 4-20
status ........................................................ 5-64
status after command execution............... 5-22
status field................................................ 5-25
status flag................................................. 5-59
status report on error occurrence ............. 6-21
status, off-line data collection.................. 5-59
structure, data buffer................................ 6-13
subassembly............................................... 4-2
subcommand............................................ 5-53
surface temperature measurement
spindle........................................................ 4-2
spindle motor ............................................. 2-2
spindle motor control............................... 4-20
spindle motor control circuit.................... 4-14
spindle motor driver circuit ....................... 4-3
stable rotation mode................................. 4-20
staggered spin-up ..................................... 5-11
standard value, surface temperature........... 3-6
STANDBY .............................................. 5-47
STANDBY IMMEDIAT ......................... 5-45
standby mode............................................. 6-9
start mode ................................................ 4-20
status ........................................................ 5-64
status after command execution............... 5-22
status field................................................ 5-25
status flag................................................. 5-59
status report on error occurrence ............. 6-21
status, off-line data collection.................. 5-59
structure, data buffer................................ 6-13
subassembly............................................... 4-2
subcommand............................................ 5-53
surface temperature measurement
point ....................................................... 3-6
surface temperature standard value............ 3-6
system configuration.................................. 2-3
system configuration.................................. 2-3
T
tag field information ...................5-129, 5-130
temperature, ambient ................................. 3-6
test span ................................................... 5-67
theory of device operation ......................... 4-1
total number of drive error....................... 5-64
track following operation......................... 4-19
temperature, ambient ................................. 3-6
test span ................................................... 5-67
theory of device operation ......................... 4-1
total number of drive error....................... 5-64
track following operation......................... 4-19
U
unrecoverable read error ..........................1-11
user password.........................................5-108
using read segment buffer ........................6-16
user password.........................................5-108
using read segment buffer ........................6-16
V
VCM current sense resistor (CSR)...........4-15
viterbi detection circuit ............................4-11
viterbi detection circuit ............................4-11
W
wide temperature range ..............................1-2
worst case attribute value .........................5-59
WRITE BUFFER.....................................5-87
write cache ....................................... 1-3, 6-20
write circuit ................................................4-9
WRITE DMA...........................................5-83
WRITE DMA EXT................................5-132
WRITE DMA FUA EXT .......................5-141
WRITE FP DMA QUEUED..................5-143
WRITE FP DMA QUEUED
worst case attribute value .........................5-59
WRITE BUFFER.....................................5-87
write cache ....................................... 1-3, 6-20
write circuit ................................................4-9
WRITE DMA...........................................5-83
WRITE DMA EXT................................5-132
WRITE DMA FUA EXT .......................5-141
WRITE FP DMA QUEUED..................5-143
WRITE FP DMA QUEUED
command protocol ..............................5-155
WRITE LOG EXT .................................5-136
WRITE MULTIPLE ................................5-77
WRITE MULTIPLE EXT .....................5-135
WRITE MULTIPLE FUA EXT.............5-140
write precompensation ...............................4-9
WRITE SECTOR (S) EXT ....................5-131
WRITE SECTOR(S)................................5-34
WRITE VERIFY......................................5-36
write/read recovery ..................................4-18
WRITE MULTIPLE ................................5-77
WRITE MULTIPLE EXT .....................5-135
WRITE MULTIPLE FUA EXT.............5-140
write precompensation ...............................4-9
WRITE SECTOR (S) EXT ....................5-131
WRITE SECTOR(S)................................5-34
WRITE VERIFY......................................5-36
write/read recovery ..................................4-18