Intel DP67BGB3 BOXDP67BGB3 用户手册

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BOXDP67BGB3
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europe
  Nemko certified to EN 60950 International 
  Nemko certified to IEC 60950 
  (CB report with CB certificate)
eMc regulations (tested in representative chassis)
united States
  FCC Part 15, Class B 
  FCC Part 15, Class B open-chassis (cover off) testing
canada
  ICES-003, Class B
europe
  EMC directive 89/336/EEC; EN 55022:1998 
  Class B; EN 55024:1998
Australia/New Zealand
  AS/NZS 3548, Class B
taiwan
  CNS 13438, Class B International 
  CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via 
EN55022 +6 db in system configurations with an 
open chassis and EU Directive 89/336/EEC and use 
via EN55022 and EN50082-1 in a representative 
chassis.
Lead-free: The symbol is used to identify 
electrical and electronic assemblies and com-
ponents in which the lead (Pb) concentration 
level in any of the raw materials and the end prod-
uct is not greater than 0.1% by weight (1000 ppm). 
This symbol is also used to indicate conformance 
to lead-free requirements and definitions adopted 
under the European Union’s Restriction on Hazardous 
Substances (RoHS) directive, 2002/95/EC.
ProceSSor 
Processor Support 
• Intel® Core™ i7 and Intel® Core™ i5 processors in the 
  LGA1155 package 
• Intel® Turbo Boost Technology
4
 
• Intel® Hyper-Threading Technology
5
 
• Integrated Memory Controller with support for up 
  to 32 GB
6
 of system memory DDR3 +1600
1
 / 
  1333 / 1066 MHz SDRAM  
• Intel® Fast Memory Access  
• Supports Intel® 64 architecture
8
cHiPSet
New intel® P67 express chipset
• Intel® 82P67 Platform Controller Hub (PCH) 
• Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)  
• Six onboard SATA ports  
• One eSATA (3.0 Gb/s) port on the back panel  
  provided by a Marvell* 88SE6111 controller
uSb PortS
integrated intel® PcH controller
• Eight Hi-Speed USB 2.0 ports via back panel 
• Six additional ports via three internal headers 
• Two SuperSpeed USB 3.0 ports via NEC controller
System bioS
• 32 Mb Flash EEPROM with Intel® Platform 
  Innovation Framework for EFI Plug and Play, IDE 
  drive auto-configure 
• Advanced configuration and power interface 
  V3.0b, DMI 2.5 
intel® rapid bioS boot
• Intel® Rapid BIOS Boot 
• Intel® Express BIOS update support: BIOS update 
  via new F7 function key
  1
 Warning: Altering clock frequency and/or voltage may (i) reduce 
system stability and useful life of the system and processor; (ii) 
cause the processor and other system components to fail; (iii) 
cause reductions in system performance; (iv) cause additional 
heat or other damage; and (v) affect system data integrity. Intel 
has not tested, and does not warranty, the operation of the 
processor beyond its specifications.
  2
 Intel® Extreme Tuning Utility is only compatible with Intel® Desk-
top Boards based on the Intel® X38 Express Chipset and newer. 
Auto-tuning capabilities may not be available for all Extreme 
Series motherboards. 
  3
 The Intel® Core Utilities Bundle includes Intel® Integrator Assis-
tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel® 
Express BIOS Update.
  4
 Intel® Turbo Boost Technology requires a PC with a processor with 
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and 
overall system configuration. Check with your PC manufacturer on 
whether your system delivers Intel Turbo Boost Technology. See 
www.intel.com/technology/turboboost for more information.
Intel® Desktop Board DP67BG Extreme Series  
Technical Specifications
Hardware Management features
• Processor fan speed control 
• System chassis fan speed control 
• Voltage and temperature sensing 
• Fan sensor inputs used to monitor fan activity 
• Power management support for ACPI 3.0b
intel® Pro 10/100/1000 Network connection
• New low-power design can meet Energy Star* 5.0 
  specifications
expansion capabilities
• One PCI Express* 2.0 x16 connector, switchable  
 to two PCI Express 2.0 x8 connectors  
• Three PCI Express 2.0 x1 connectors 
• Two PCI connectors
Audio
• 10-channel Intel® High Definition Audio
7
 codec 
• 8-channel via the back panel  
• 2-channel via the front panel 
• Back panel support for output via optical cable 
• One internal header for S/PDIF output for HDMI* 
  support
SYSteM MeMorY
Memory capacity
• Four 240-pin DIMM connectors supporting up to 
  two double-sided DIMMs 
• Maximum system memory up to 32 GB
6
 using 8 GB 
  double-sided DIMMs
Memory types
• DDR3 +1600 / 1333 / 1066 SDRAM memory support 
• Non-ECC Memory
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
• 1.35 V low voltage 
• 1.5 V standard JEDEC voltage 
• Support for Intel® XMP extended voltage profiles
JuMPerS AND froNt-PANeL coNNectorS
Jumpers
• Single configuration jumper design 
• Jumper access for BIOS maintenance mode
front-Panel connectors
• Reset, HD LED, Power LEDs, power on/off 
• Three front-panel Hi-Speed USB 2.0 headers 
• Front-panel audio header 
• One IEEE 1394a header
MecHANicAL
board Style
• ATX
board Size
• 9.6” x 11.6” (24.38 cm x 29.46 cm)
baseboard Power requirements
• ATX 12 V
eNViroNMeNt
operating temperature
• 0° C to +55° C
Storage temperature
• -20° C to +70° C
reGuLAtioNS AND SAfetY StANDArDS
united States and canada
  UL 1950, Third edition—CAN/CSA C22.2 
  No. 950-95 with recognized U.S. and Canadian 
  component marks
For ordering information, visit www.intel.com 
For the most current product information, visit www.intel.com/go/idb  
or http://ark.intel.com 
For specific CPU compatibility, visit http://processormatch.intel.com
  5
 Intel® Hyper-Threading Technology requires a computer system 
with a processor supporting HT Technology and an HT Technol-
ogy-enabled chipset, BIOS, and operating system. Performance 
will vary depending on the specific hardware and software you 
use. For more information including details on which processors 
support HT Technology, see www.intel.com/info/hyperthreading. 
  6
 System resources and hardware (such as PCI and PCI Express*) 
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction 
of as much as 1 GB or more of physical addressable memory being 
available to the operating system and applications, depending on 
the system configuration and operating system.
  7
 Intel® High Definition Audio requires a system with an appropriate 
Intel® chipset and a motherboard with an appropriate codec and 
the necessary drivers installed. System sound quality will vary 
depending on actual implementation, controller, codec, drivers, 
and speakers. For more information about Intel® HD Audio, refer 
to www.intel.com/design/chipsets/hdaudio.htm
  8
 64-bit computing on Intel® architecture requires a computer 
system with a processor, chipset, BIOS, operating system, device 
drivers, and applications enabled for Intel® 64 architecture. 
Processors will not operate (including 32-bit operation) without 
an Intel 64 architecture-enabled BIOS. Performance will vary 
depending on your hardware and software configurations. See 
http://developer.intel.com/technology/intel64/index.htm for 
more information.
   INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION 
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY 
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY 
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN 
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, 
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO 
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY 
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR 
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
   Intel products are not intended for use in medical, life-saving,  
or life-sustaining applications. Intel may make changes to speci-
fications and product descriptions at any time, without notice.
   All products, dates, and figures specified are preliminary based 
on current expectations, and are subject to change without 
notice. Availability in different channels may vary.
   Actual Intel® Desktop Board may differ from the image shown.
   Intel, the Intel logo, and Intel Core are trademarks of Intel  
Corporation in the U.S. and other countries.
 * Other names and brands may be claimed as the property of others.
   Copyright © 2010 Intel Corporation. All rights reserved.  
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