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HP
385548-131
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HP 385548-131 用户手册
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Removal and Replacement Procedures
Maintenance and Service Guide
5–53
1.
Prepare the notebook for disassembly (
Section 5.3
) and
remove the following components:
a. Hard drive (
Section 5.4
)
b. MultiBay II de
vice (
Section 5.6
)
c. Bluetooth board (
Section 5.8
)
d. Ke
yboard (
Section 5.9
)
e. Switch cove
r (
Section 5.10
)
f. Thermal plate (
Section 5.12
)
g.
Heat sink (
Section 5.13
)
h. TouchP
ad (
Section 5.17
)
i.
Display assembly (
Section 5.19
)
j. Top cov
er (
Section 5.20
)
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