MEDs Technologies Pte Ltd MBTM64 用户手册
MEDS Technologies Bluetooth Module64 Datasheet V0.8
CONFIDENTIAL
2nd-July-2012 17/18
6. SOLDERING RECOMMENDATIONS
6.1 Baking Recommendation
Baking condition：
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high temperature
After bag is opened, devices that will be subjected to reflow solder or other high temperature
process must be Mounted within 72 hours of factory conditions <30°C/60% RH, or Stored at
<10% RH.
<10% RH.
Devices require bake, before mounting, if Humidity Indicator Card reads >10%
If baking is required, Devices may be baked for 4 hrs at 100 °C.
If baking is required, Devices may be baked for 4 hrs at 100 °C.
6.2 SMT Recommendation
No.
Item
Temperature (
o
C)
Time (sec)
1
Pre-heat
D1: 140~D2:200
T1 : 80~120
2
Soldering
D2 : = 220
T2 : 60 +/- 10
3
Peak=temperature
D3 : 250
o
C max
Figure 6.2.1: Reflow Soldering Profile
1. It is recommended to do reflow soldering for maximum two times.
2. Add Nitrogen while reflow process: SMT solder ability will be better.
7. ORDERING INFORMATION
Part Number : MBTM64-x : Module 64, where x refers to
0: HCI ; 1: SPP ; 2 : HID ; 3 : BLE ; 4 : HDP
0: HCI ; 1: SPP ; 2 : HID ; 3 : BLE ; 4 : HDP