MEDs Technologies Pte Ltd MBTM64 用户手册
MEDS Technologies Bluetooth Module64 Datasheet V0.8
CONFIDENTIAL
2nd-July-2012 3/18
Contents
1. INTRODUCTION........................................................................................................................................................... 4
2. PACKAGE INFORMATION ........................................................................................................................................ 5
2.1 SIGNAL LAYOUT (TOP VIEW) ................................................................................................................. 5
2.2 PIN DESCRIPTIONS..................................................................................................................................... 6
3. FUNCTIONAL FEATURES.......................................................................................................................................... 7
3.1 APPLICATION BLOCK DIAGRAM........................................................................................................... 7
3.2 HARDWARE INTERFACE ......................................................................................................................... 8
3.2.1 UART Interface ……................................................................................................................. 8
3.2.2 USB Interface ........................................................................................................................... 10
3.2.3 Codec Digital Interface............................................................................................................. 11
3.2.4 I2C/SPI Interface...................................................................................................................... 12
3.2.5 Wi-Fi Co-existence Interface……………………………………………………………………13
3.2.6 JTAG Interface……………………………………………….…………………………...….…14
4. ELECTRICAL SPECIFICATION........................................................................................................................... ….15
4.1 ABSOLUTE MAXIMUM RATINGS...........................................................................................................15
4.2 RF CHARACTERISTIC ............................................................................................................................. 15
5. PCB LAYOUT RECOMMENDATION...................................................................................................................... 16
6. SMT AND BAKING RECOMMENDATION............................................................................................................ 17
6.1 BAKING RECOMMENDATION .............................................................................................................. 17
6.2 SMT RECOMMENDATION.......................................................................................................................17
7. ORDERING INFORMATION.................................................................................................................................... 17
8. FCC STATEMENT……………………………………………………………………………………………………18