Peiker acustic GmbH V1233-0 用户手册

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Seite 7

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

2.6 Certifications / Approvals

GCF

RED

PTCRB

FCC/IC

AT&T

V1230-0

Planned

V1231-0

Planned

V1232-0

Planned

V1233-0

Planned

2.7 HW Features

- Qualcomm X12 LTE, 20nmSoC

- MDM9240 Baseband / PMIC: PMD9645 / WTR3925 WTR4905

- Cortex-A7 up to 1.2 GHz

- Modem and low power audio sub systems: QDSP6 processor at up to 850 MHz (turbo)

- RPM Resource and power manager: Cortex M3 up to 100 MHz

- 4Gb NAND Flash

- 2Gb LPDDR2 SDRAM

- 19.2MHz clock reference

- GPS, GLONASS, BeiDou, and Galileo

2.8 Connectors

2.8.1 Module Signal and RF Connectors

LTE-NAD-A has 172 signal pins (2xAA and 2xBB) connector pads with 1.0mm pitch. The signal pads are

located close to the board edges.

There are three antenna pads, each collocated by RF GND connectors

- Main transmit and receive antenna – pin LGA_PRX_ANT

- Diversity antenna for WCDMA respective MIMO antenna for LTE – pin LGA_DRX_ANT_IN

- GNSS antenna for both GPS and GLONASS – pin LGA_GPS_DRX_ANT

2.8.2 Ground and Heat Dissipation Connectors

To support the usage of module under complicated thermal conditions, there are a number of large

grounded pads in the center of PCB. These pads are dedicated ground pads to transfer heat dissipation

to a carrier board.

This should be especially considered by customer designs. A reference design showing landing patterns

and PCB stack-up is available on request.