Kingston Technology 8GB DDR3 2133MHz Kit KHX2133C9D3T1K2/8GX 数据表

Kingston's KHX2133C9D3T1K2/8GX is a kit of two 512M x 64-

bit (4GB) DDR3-2133 CL9 SDRAM (Synchronous DRAM) 2Rx8

memory modules, based on sixteen 256M x 8-bit DDR3 FBGA

components per module. Each module kit supports Intel

(Extreme Memory Profiles). Total kit capacity is 8GB. Each

module kit has been tested to run at DDR3-2133 at a low

latency timing of 9-11-10 at 1.65V. The SPDs are programmed

to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.

Each 240-pin DIMM uses gold contact fingers. The JEDEC

standard electrical and mechanical specifications are as

follows:

CL(IDD)

9 cycles

Row Cycle Time (tRCmin)

49.5ns (min.)

Refresh to Active/Refresh

160ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin)

36ns (min.)

Power (Operating)

2.225 W* (per module)

UL Rating

94 V - 0

Operating Temperature

0

o

 C to 85

o

 C

Storage Temperature

-55

o

 C to +100

o

 C

*Power will vary depending on the SDRAM used.

•

JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

•

VDDQ = 1.5V (1.425V ~ 1.575V)

•

667MHz fCK for 1333Mb/sec/pin

•

8 independent internal bank

•

Programmable CAS Latency: 9, 8, 7, 6

•

Posted CAS

•

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

•

Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

•

8-bit pre-fetch

•

Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]

•

Bi-directional Differential Data Strobe

•

Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)

•

On Die Termination using ODT pin

•

Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C

•

Asynchronous Reset

•

PCB : Height 2.401” (61.00mm) w/ heat spreader,

double sided component

Memory Module Specifi cations

Continued >>

8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-2133MHz CL9 240-Pin DIMM Kit

•

JEDEC: DDR3-1333 CL9-9-9 @1.5V

•

XMP Profile #1: D3-1866 CL9-11-9 @1.65V

•

XMP Profile #2: D3-2133 CL9-11-10 @1.65V