TDK Corporation SESUB BU 14808 用户手册

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页码 14
© TDK Corporation 2013-2014  
 
 
 
 
 
 
 
 
 
 
 
 
 
 
10 
All specifications are subject to change without notice. 
SP14808 Bill Of Materials 
SMD
Side
Remarks
Description
Designator
Quantity
Mount
Top
1608 Size Chip Antenna/0.15mm min pitch land
ANT016008LCS2442MA2
ANT1
1
Mount
Top
0603 Size Ceramic Capacitor 1uF
Ceramic Capacitor 1uF 0603/C0603X5R0J105M030BC
C7
1
Mount
Bottom
30pins 0.5mm pich Hirose Connector/DF23 2x15
DF23C-30DP-0.5V
J1
1
Mount
Top
1005 Size Inductor 1.6nH
1005 Size 1.6nH Inductor  MHQ1005P1N6BT
L1, L2
2
Mount
Top
0603 Size Resistor 10K
10K:RK73B1HTTC103J
R1, R2
2
Mount
Top
0603 Size Resistor 10K
10K:RK73B1HTTC103J
R3
1
Mount
Bottom
1005 Size Resistor 0
0:RK73Z1ETTP
R7
1
Mount
Bottom
1005 Size Resistor 0
0:RK73Z1ETTP
R8
1
Mount
Top
2x3mm Size 8pin MXIC IC/MO-252 USON 8L 0.5mm pitch
Flash Memory : MX25V1006E-USON
U2
1
Mount
Top
3.5x3.5mm Size Module/0.4mm pad pitch,0.2mm pad
SESUB-PAN-D14580
U1
1
Mount
Top
2012 Size 2pin Epson Toyocom Xtal/2.05x1.2mm
FC-12M 32.768KHZ 7.0 +20.0/-20.0
X1
1
Mount
Top
P01C-1111-06 SHIELD CASE
P01C-1111-06 SHIELD CASE
S1
1