Intel III Xeon 800 MHz 80526KZ800256 用户手册
产品代码
80526KZ800256
BOXED PROCESSOR SPECIFICATIONS
89
processor does not ship with an auxiliary fan, it is highly recommended that a power header be provided. It is
also recommended that the power header be consistent with the power header for other boxed processors
that feature a fan-sense capable fan heatsink. Figure 40 shows the typical boxed processor fan/heatsink
power cable connector. Table 54 shows the typical boxed processor fan power cable connector requirements.
The actual requirements for the auxiliary fan power may vary. Consult your fan manufacturer and/or fan
documentation for specifications.
also recommended that the power header be consistent with the power header for other boxed processors
that feature a fan-sense capable fan heatsink. Figure 40 shows the typical boxed processor fan/heatsink
power cable connector. Table 54 shows the typical boxed processor fan power cable connector requirements.
The actual requirements for the auxiliary fan power may vary. Consult your fan manufacturer and/or fan
documentation for specifications.
Pin
Signal
Straight square pin, 3-pin terminal housing with
polarizing ribs and friction locking ramp.
polarizing ribs and friction locking ramp.
0.100" pin pitch, 0.025" square pin width.
Waldom*/Molex* P/N 22-01-3037 or equivalent.
Match with straight pin, friction lock header on motherboard
Waldom/Molex P/N 22-23-2031, AMP* P/N 640456-3,
or equivalent.
Waldom/Molex P/N 22-23-2031, AMP* P/N 640456-3,
or equivalent.
1
2
3
GND
+12V
SENSE
1
2
3
000888
Figure 40. Standard Boxed Processor Fan/Heatsink Power Cable Connector Description
Table 54. Fan/Heatsink Power and Signal Specifications
Description Min
Typ
Max
+12V: 12 volt fan power supply
7V
12V
13.8V
IC: Fan current draw
100mA
SENSE: SENSE frequency (baseboard should pull
this pin up to appropriate V
CC
with resistor (typically
10 to 12 k
Ω
)
2 pulses per
fan revolution
9.3.2.3 Thermal evaluation for auxiliary fan
Given the complex and unique nature of baseboard layouts, and the special chassis required to support them,
thermal performance may vary greatly with each baseboard/chassis combination. Baseboard manufacturers
must evaluate and recommend effective thermal solutions for their specific designs, particularly designs that
are proprietary. Such thermal solutions must take all system components into account. The power
requirements of all processors that will be supported by the baseboard should be accommodated. The boxed
Pentium® III Xeon™ processor at 700 MHz and 900 MHz is designed to provide a flexible cooling solution by
incorporating features by which an auxiliary fan may be attached.
thermal performance may vary greatly with each baseboard/chassis combination. Baseboard manufacturers
must evaluate and recommend effective thermal solutions for their specific designs, particularly designs that
are proprietary. Such thermal solutions must take all system components into account. The power
requirements of all processors that will be supported by the baseboard should be accommodated. The boxed
Pentium® III Xeon™ processor at 700 MHz and 900 MHz is designed to provide a flexible cooling solution by
incorporating features by which an auxiliary fan may be attached.
Should the system thermal evaluation
warrant the requirement for an auxiliary fan, an auxiliary fan must be included with the baseboard to allow the
thermal requirements of the system to be met.
thermal requirements of the system to be met.