Intel i3-3110M AW8063801032700 用户手册

产品代码

AW8063801032700

Datasheet, Volume 1

Contents

Introduction ............................................................................................................ 11
1.1

Processor Feature Details ................................................................................... 13
1.1.1

Supported Technologies .......................................................................... 13

1.2

Interfaces ........................................................................................................ 13
1.2.1

System Memory Support ......................................................................... 13

1.2.2

PCI Express* ......................................................................................... 14

1.2.3

Direct Media Interface (DMI).................................................................... 15

1.2.4

Platform Environment Control Interface (PECI)........................................... 16

1.2.5

Processor Graphics ................................................................................. 16

1.2.6

Embedded DisplayPort* (eDP*)................................................................ 17

1.2.7

Intel

Flexible Display Interface (Intel

FDI) ............................................. 17

1.3

Power Management Support ............................................................................... 17
1.3.1

Processor Core....................................................................................... 17

1.3.2

System ................................................................................................. 17

1.3.3

Memory Controller.................................................................................. 17

1.3.4

PCI Express* ......................................................................................... 17

1.3.5

Direct Media Interface (DMI).................................................................... 17

1.3.6

Processor Graphics Controller (GT) ........................................................... 18

1.3.7

Thermal Management Support ................................................................. 18

1.4

Processor Family SKU Definition .......................................................................... 18

1.5

Package ........................................................................................................... 19

1.6

Processor Compatibility ...................................................................................... 19

1.7

Terminology ..................................................................................................... 20

1.8

Interfaces................................................................................................................ 25
2.1

System Memory Interface .................................................................................. 25
2.1.1

System Memory Technology Supported ..................................................... 25

2.1.2

System Memory Timing Support............................................................... 26

2.1.3

System Memory Organization Modes......................................................... 27
2.1.3.1

Single-Channel Mode................................................................. 27

2.1.3.2

Dual-Channel Mode – Intel

Flex Memory Technology Mode ........... 27

2.1.4

Rules for Populating Memory Slots............................................................ 28

2.1.5

Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 29

2.1.5.1

Just-in-Time Command Scheduling.............................................. 29

2.1.5.2

Command Overlap .................................................................... 29

2.1.5.3

Out-of-Order Scheduling ............................................................ 29

2.1.6

Data Scrambling .................................................................................... 29

2.1.7

DRAM Clock Generation........................................................................... 29

2.1.8

DDR3 Reference Voltage Generation ......................................................... 30

2.2

PCI Express* Interface....................................................................................... 30
2.2.1

PCI Express* Architecture ....................................................................... 30
2.2.1.1

Transaction Layer ..................................................................... 31

2.2.1.2

Data Link Layer ........................................................................ 31

2.2.1.3

Physical Layer .......................................................................... 31

2.2.2

PCI Express* Configuration Mechanism ..................................................... 32

2.2.3

PCI Express* Graphics ............................................................................ 33
2.2.3.1

PCI Express* Lanes Connection .................................................. 33

2.3

Direct Media Interface (DMI)............................................................................... 34
2.3.1

DMI Error Flow....................................................................................... 34

2.3.2

Processor / PCH Compatibility Assumptions................................................ 34