HP BLc7000 681840-B21 用户手册
产品代码
681840-B21
HP BladeSystem c-Class
c7000 Enclosure
c7000 Enclosure
A BladeSystem c7000 enclosure holds up to 16 servers and/or up to 8 expansion blades (not exceeding 16
total blades) plus redundant network and storage interconnects. It includes a shared, multi-terabit high-
speed mid-plane for wire-once connectivity of server blades to network and shared storage. Power is
delivered through a pooled power backplane that ensures the full capacity of the redundant hot-plug
power supplies is available to all blades.
total blades) plus redundant network and storage interconnects. It includes a shared, multi-terabit high-
speed mid-plane for wire-once connectivity of server blades to network and shared storage. Power is
delivered through a pooled power backplane that ensures the full capacity of the redundant hot-plug
power supplies is available to all blades.
Each c7000 enclosure is built with the following functions:
Up to 16 half-height , 8 full-height server blades, and/or 8 expansion blades per enclosure.
NOTE: For information on mixing half-height server blades, full-height server blades, and expansion
blades, please see the section titled "Server Blade, Expansion Blade, and Fan Population Guidelines"
later in this document.
blades, please see the section titled "Server Blade, Expansion Blade, and Fan Population Guidelines"
later in this document.
Up to 4 redundant interconnect fabrics (Ethernet, FC, IB, iSCSI, SAS, etc.) supported simultaneously
within the enclosure.
Choice of a single-phase, three-phase or a -48V DC power subsystem for flexibility in connecting to
datacenter power.
HP Thermal Logic technology for lower power consumption and airflow.
Four (4) or Ten (10) Active Cool 200 fans as standard. For redundancy and improved power
consumption and acoustics; additional Active Cool 200 Fan kits can be added for a maximum of 10
fans.
Redundant hot-plug cooling, redundant hot-plug power supplies, redundant connections,
redundant interconnect modules, and optional redundant BladeSystem Onboard Administrator
management modules.
Lowest cost of ownership.
Full AC redundancy with no power zones.
within the enclosure.
Choice of a single-phase, three-phase or a -48V DC power subsystem for flexibility in connecting to
datacenter power.
HP Thermal Logic technology for lower power consumption and airflow.
Four (4) or Ten (10) Active Cool 200 fans as standard. For redundancy and improved power
consumption and acoustics; additional Active Cool 200 Fan kits can be added for a maximum of 10
fans.
Redundant hot-plug cooling, redundant hot-plug power supplies, redundant connections,
redundant interconnect modules, and optional redundant BladeSystem Onboard Administrator
management modules.
Lowest cost of ownership.
Full AC redundancy with no power zones.
An BladeSystem Onboard Administrator management module is built in to the enclosure with the
following functions:
following functions:
Robust, multiple enclosure setup and control.
Reports asset and inventory information for the devices in the enclosure.
Reports thermal and power information, including real-time actual power usage per server and per
enclosure.
Front-mounted Insight Display for easy management within the datacenter.
Integrated access to all server blade iLOs from a single cable.
Provides integrated access to interconnect bay device management ports from the single
BladeSystem Onboard Administrator cable.
Single sign-on capability for all devices in the enclosure
Role-based security locally and/or with LDAP directory services.
Provides a wizard-based initial setup process for easy configuration.
Reports asset and inventory information for the devices in the enclosure.
Reports thermal and power information, including real-time actual power usage per server and per
enclosure.
Front-mounted Insight Display for easy management within the datacenter.
Integrated access to all server blade iLOs from a single cable.
Provides integrated access to interconnect bay device management ports from the single
BladeSystem Onboard Administrator cable.
Single sign-on capability for all devices in the enclosure
Role-based security locally and/or with LDAP directory services.
Provides a wizard-based initial setup process for easy configuration.
A BladeSystem c7000 enclosure provides the following benefits:
With local and remote hardware management integrated across the solution, one full enclosure can
be managed as easily as one server.
Scalable: Management and network interconnects extend scalability beyond a single enclosure,
allowing resources to be pooled and shared across multiple enclosures.
Investment protection: Accommodates multiple server and network designs in one enclosure.
Lower costs per server, in comparison to rack-mounted servers
Lower power consumption, in comparison to rack-mounted servers.
Lower airflow requirements, in comparison to rack-mounted servers
be managed as easily as one server.
Scalable: Management and network interconnects extend scalability beyond a single enclosure,
allowing resources to be pooled and shared across multiple enclosures.
Investment protection: Accommodates multiple server and network designs in one enclosure.
Lower costs per server, in comparison to rack-mounted servers
Lower power consumption, in comparison to rack-mounted servers.
Lower airflow requirements, in comparison to rack-mounted servers
QuickSpecs
HP BladeSystem c7000 Enclosure
HP BladeSystem c-Class Overview
DA - 12810 Worldwide — Version 53 — March 31, 2014
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