Intermec 073290-001 用户手册

A custom debug board supporting Ethernet, logic analyzer connectors, 
hexadecimal debug LEDs, and test and reset switches connects to these 
connectors through a buffered “pod board” and flex and ribbon cable 
assembly: 

073274 PCB 

ASSY,DEBUG,CX1 

073418 

FLEX CIRCUIT,J34,TEST FIXTURE 

073419 

FLEX CIRCUIT,J33,TEST FIXTURE 

073420 

FLEX CIRCUIT,J35,TEST FIXTURE 

591813 CBL,RIBBON,68 

POS,SHIELDED 

J33 is pinned out to be compatible with the commercially available 
Microsoft Debug Board. See the Microsoft Debug Board Specification, 
V2.4, for details. 

For the current release (version 1.01.01.0229) of the CK30, the only 
upgrade route for the bootloader is to cold boot the CK30 with an SD 
card containing an image of the new bootloader. The bootloader is divided 
into 2 parts – Primary and Secondary. Only the Secondary portion is 
intended to be field-upgradeable; the Primary bootloader is fixed. This is 
partly for risk reduction: the Primary bootloader is responsible for reading 
the upgrade image from the SD card and writing it to flash. If the Primary 
bootloader were to become corrupted while upgrading itself, the CK30 
would become unusable and would have to be returned to a service depot 
for repair. 

In the event the Primary bootloader becomes corrupted or needs service 
depot upgrade, it can also be reflashed using Intel’s JFLASH utility 
through the P1 JTAG port (See “Field-Access Debug Port” on page 93), 
using a parallel port JTAG cable such as the Insight Model IJC-2. 

For the current release (version 1.01.01.0229), the only way to upgrade 
the OS image is to cold boot the CK30 with an SD card containing an 
image of the OS image. The Primary bootloader boots the system and 
looks for a new image file on an installed SD card. If the card and file are 
present, the bootloader downloads the image into SDRAM, erases the 
relevant portions of the system flash, then writes the OS image to flash. 
When the write is complete, the system cold boots into the new image.