Intel 1005M AW8063801121200 用户手册

产品代码

AW8063801121200

Datasheet, Volume 1

4.2.1

Enhanced Intel

SpeedStep

Technology.................................................. 52

4.2.2

Low-Power Idle States ............................................................................ 53

4.2.3

Requesting Low-Power Idle States ............................................................ 54

4.2.4

Core C-states......................................................................................... 55
4.2.4.1

Core C0 State........................................................................... 55

4.2.4.2

Core C1 / C1E State .................................................................. 55

4.2.4.3

Core C3 State........................................................................... 55

4.2.4.4

Core C6 State........................................................................... 55

4.2.4.5

Core C7 State........................................................................... 56

4.2.4.6

C-State Auto-Demotion.............................................................. 56

4.2.5

Package C-States ................................................................................... 56
4.2.5.1

Package C0 .............................................................................. 58

4.2.5.2

Package C1/C1E ....................................................................... 58

4.2.5.3

Package C3 State...................................................................... 58

4.2.5.4

Package C6 State...................................................................... 58

4.2.5.5

Package C7 State...................................................................... 59

4.2.5.6

Dynamic L3 Cache Sizing ........................................................... 59

4.3

Integrated Memory Controller (IMC) Power Management ........................................ 59
4.3.1

Disabling Unused System Memory Outputs ................................................ 59

4.3.2

DRAM Power Management and Initialization ............................................... 60
4.3.2.1

Initialization Role of CKE ............................................................ 61

4.3.2.2

Conditional Self-Refresh............................................................. 61

4.3.2.3

Dynamic Power Down Operation ................................................. 62

4.3.2.4

DRAM I/O Power Management .................................................... 62

4.3.3

DDR Electrical Power Gating (EPG)............................................................ 62

4.4

PCI Express* Power Management ........................................................................ 63

4.5

DMI Power Management..................................................................................... 63

4.6

Graphics Power Management .............................................................................. 63
4.6.1

Intel

Rapid Memory Power Management (Intel

RMPM)

(also known as CxSR) ............................................................................. 63

4.6.2

Intel

Graphics Performance Modulation Technology (Intel

GPMT) .............. 63

4.6.3

Graphics Render C-State ......................................................................... 64

4.6.4

Intel

Smart 2D Display Technology (Intel

S2DDT) .................................. 64

4.6.5

Intel

Graphics Dynamic Frequency.......................................................... 64

4.6.6

Display Power Savings Technology 6.0 (DPST) ........................................... 65

4.6.7

Automatic Display Brightness (ADB).......................................................... 65

4.6.8

Intel

Seamless Display Refresh Rate Switching

Technology (Intel

SDRRS Technology) .................................................... 65

4.7

Graphics Thermal Power Management .................................................................. 66

Thermal Management .............................................................................................. 67
5.1

Thermal Considerations...................................................................................... 67

5.2

Intel

Turbo Boost Technology Power Monitoring................................................... 68

5.3

Intel

Turbo Boost Technology Power Control ....................................................... 68

5.3.1

Package Power Control............................................................................ 68

5.3.2

Power Plane Control................................................................................ 70

5.3.3

Turbo Time Parameter ............................................................................ 70

5.4

Configurable Thermal Design Power (cTDP) and

Low Power Mode (LPM) ...................................................................................... 70
5.4.1

Configurable TDP (cTDP) ......................................................................... 70

5.4.2

Low Power Mode .................................................................................... 71

5.5

Thermal and Power Specifications........................................................................ 72

5.6

Thermal Management Features ........................................................................... 75
5.6.1

Adaptive Thermal Monitor........................................................................ 75
5.6.1.1

TCC Activation Offset................................................................. 76

5.6.1.2

Frequency / Voltage Control ....................................................... 76

5.6.1.3

Clock Modulation....................................................................... 78