Acer E3-1220 v3 KC.12201.3E3 用户手册

This chapter provides both component-level and system-level thermal management.

Topics convered include processor thermal specifications, thermal profiles, thermal

metrology, fan speed control, adaptive thermal monitor, THERMTRIP# signal, Ditital

Thermal Sensor (DTS), Intel Turbo Boost Technology, package power control, power

plane control, and turbo time parameter.

The processor requires a thermal solution to maintain temperatures within its

operating limits. Any attempt to operate the processor outside these operating limits

may result in permanent damage to the processor and potentially other components

within the system. Maintaining the proper thermal environment is key to reliable,

long-term system operation.

A complete solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks

attached to the processor integrated heat spreader (IHS).

To allow the optimal operation and long-term reliability of Intel processor-based

systems, the processor must remain within the minimum and maximum case

temperature (T

CASE

) specifications as defined by the applicable thermal profile.

Thermal solutions not designed to provide this level of thermal capability may affect

the long-term reliability of the processor and system.

The processors implement a methodology for managing processor temperatures that

is intended to support acoustic noise reduction through fan speed control and to

assure processor reliability. Selection of the appropriate fan speed is based on the

relative temperature data reported by the processor’s Digital Temperature Sensor

(DTS). The DTS can be read using the Platform Environment Control Interface (PECI)

as described in 

 on page 69. Alternatively, when PECI is

monitored by the PCH, the processor temperature can be read from the PCH using the

SMBus protocol defined in Embedded Controller Support Provided by the PCH. The

temperature reported over PECI is always a negative value and represents a delta

below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT#

(see 

 on page 69). Systems that implement fan speed control

must be designed to use this data. Systems that do not alter the fan speed only need

to ensure the case temperature meets the thermal profile specifications.

Analysis indicates that real applications are unlikely to cause the processor to

consume maximum power dissipation for sustained time periods. Intel recommends

that complete thermal solution designs target the Thermal Design Power (TDP),

instead of the maximum processor power consumption. The Adaptive Thermal Monitor

feature is intended to help protect the processor in the event that an application

exceeds the TDP recommendation for a sustained time period. For more details on this

feature, see 

 on page 69. To ensure maximum flexibility

for future processors, systems should be designed to the Thermal Solution Capability

guidelines, even if a processor with lower power dissipation is currently planned.

Intel

®

 Xeon

®

 Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

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