Kingston Technology HX321LS11IB2K2/8 产品宣传页

HyperX HX321LS11IBK2/8 is a kit of two 512M x 64-bit (4GB)

DDR3L-2133 CL11 SDRAM (Synchronous DRAM) 1Rx8, low

voltage, memory modules, based on eight 512M x 8-bit DDR3

FBGA components per module. Total kit capacity is 8GB.

Each module kit has been tested to run at DDR3L-2133 at a

low latency timing of 11-12-13 at 1.35V or 1.5V. Additional

timing parameters are shown in the PnP Timing Parameters

section below. The JEDEC standard electrical and mechanical

specifications are as follows:

s

e

l

c

y

c

 

1

1

)

D

D

I

(

L

C

Row Cycle Time (tRCmin)

44.22ns (min.)

Refresh to Active/Refresh

260ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin)

31.875ns (min.)

Maximum Operating Power

TBD W* @1.35V

0

 

-

 

V

 

4

9

g

n

i

t

a

R

 

L

U

Operating Temperature

0

o

 C to 85

o

 C

Storage Temperature

-55

o

 C to +100

o

 C

*Power will vary depending on the SDRAM used.

8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3L-2133
CL11 204-Pin SODIMM Kit

Continued >>

•

DDR3-2133 CL11-12-13 @1.35V or 1.5V

•

DDR3-1866 CL10-11-12 @1.35V or 1.5V

•

DDR3-1600 CL9-9-10 @1.35V or 1.5V

Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.

HX318C10FB/4

•

JEDEC standard 1.35V  and 1.5V

•

VDDQ = 1.35V and 1.5V

•

1066MHz fCK for 2133Mb/sec/pin

•

8 independent internal bank

•

Programmable CAS Latency: 15, 14, 13, 12, 11, 10, 9, 8, 7, 6

•

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

•

8-bit pre-fetch

•

Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

•

Bi-directional Differential Data Strobe

•

Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

•

On Die Termination using ODT pin

•

Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE < 95°C

•

Asynchronous Reset

•

PCB : Height 1.180” (30.00mm), double  sided  component